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MRF6VP3450HR5

NXP Semiconductors

MRF6VP3450HR5 by NXP Semiconductors

NXP Semiconductors' MRF6VP3450HR5 is a RF Power FET with 110V DS Breakdown Voltage, operating in the Ultra High Frequency Band. It features N-CHANNEL polarity, SINGLE configuration, and METAL-OXIDE SEMICONDUCTOR technology. Ideal for AMPLIFIER applications, this transistor has a max temp of 225°C and comes in a CERAMIC package with FLANGE MOUNT style.

Median Price

$204.570

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

MRF6VP3450HR5 by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 34 parts In-Stock

1+ parts

$133.000

100+ parts

-

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34

$133.000

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Rochester

USA . 50 parts In-Stock

1+ parts

$204.570

100+ parts

$192.290

1k+ parts

$173.880

10k+ parts

-

50

$204.570

$192.290

$173.880

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Element14

Singapore . 34 parts In-Stock

1+ parts

$284.600

100+ parts

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34

$284.600

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Distributors (In-Stock)

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Digiode

USA . 3,119 parts In-Stock

1+ parts

$194.342

100+ parts

-

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3,119

$194.342

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Nova Conductors

Japan . 68 parts In-Stock

1+ parts

$204.991

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68

$204.991

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Vyrian

USA . 3,966 parts In-Stock

1+ parts

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3,966

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Anansix

USA . 1,515 parts In-Stock

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1,515

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DigiKey Marketplace

USA . 317 parts In-Stock

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317

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Distributors (Availability)

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Corohmni

South Africa . 87 parts In-Stock

1+ parts

$0.375

100+ parts

-

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87

$0.375

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AZTECH Wire

Italy . 597 parts In-Stock

1+ parts

$17.444

100+ parts

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597

$17.444

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Continental Prestige Electronics

USA . 477 parts In-Stock

1+ parts

$159.430

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477

$159.430

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One Stop Electronics

USA . 50 parts In-Stock

1+ parts

$173.880

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50

$173.880

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Ampacity Inc.

Singapore . 50 parts In-Stock

1+ parts

$173.880

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50

$173.880

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Corphita

USA . 558 parts In-Stock

1+ parts

$184.113

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558

$184.113

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Microchip USA

USA . 275 parts In-Stock

1+ parts

$345.555

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275

$345.555

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Robosynatics

Brazil . 23,297 parts In-Stock

1+ parts

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100+ parts

$1.199

1k+ parts

$1.174

10k+ parts

$1.174

23,297

-

$1.199

$1.174

$1.174

Lucentia Tech

USA . 23,297 parts In-Stock

1+ parts

-

100+ parts

$1.199

1k+ parts

$1.174

10k+ parts

$1.174

23,297

-

$1.199

$1.174

$1.174

UNI Independent Distributors

Spain . 7,034 parts In-Stock

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7,034

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Lixinc

USA . 3,706 parts In-Stock

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3,706

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Argo Parts USA

USA . 3,527 parts In-Stock

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3,527

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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1,800

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Perfect Parts

USA . 12 parts In-Stock

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12

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Overview

Unleash the power of cutting-edge technology with the MRF6VP3450HR5 by NXP Semiconductors. Crafted with precision and expertise, this RF Power Field Effect Transistor offers unparalleled performance in amplifier applications. With its ceramic, metal-sealed co-fired package body material and N-channel configuration, this transistor guarantees reliability and durability. Experience seamless operation in the ultra-high frequency band with a minimum DS breakdown voltage of 110V. Elevate your projects to the next level with the MRF6VP3450HR5 - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This durable package material ensures high reliability and performance in demanding applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors offer superior conductivity and efficiency compared to P-channel transistors, making them ideal for high power applications.

Configuration: SINGLE

Single configuration simplifies circuit design and layout, making integration easier for designers.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, providing high gain and low noise for audio or RF signal amplification.

Surface Mount: YES

Surface mount capability allows for easy and compact integration onto circuit boards, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 110 V

With a high breakdown voltage, this transistor can handle high voltage applications with ease.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on circuit boards, optimizing layout and design.

Terminal Form: FLAT

Flat terminals provide a secure connection and make soldering easier during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for improved control over the transistor's conductivity, enhancing performance in various applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capable of operating in the ultra-high frequency band, making it suitable for high-speed and high-frequency applications.

No. of Terminals: 4

With 4 terminals, this transistor offers flexible connectivity options for different circuit configurations.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides a secure and stable mounting option for heavy-duty applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency and fast switching speeds, making it ideal for power amplifier applications.

Maximum Operating Temperature: 225 °C

With a high maximum operating temperature, this transistor can withstand harsh environmental conditions without sacrificing performance.

Transistor Element Material: SILICON

Silicon material offers high performance and reliability, ensuring long-term stability in various applications.

Terminal Position: DUAL

Dual terminal positions provide flexibility in circuit layout and connectivity options for different design requirements.

Case Connection: SOURCE

Source connection provides a common reference point for the transistor, simplifying circuit design and ensuring consistent performance.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum reflow time of 40 seconds at peak temperature, this transistor is easy to solder and integrate onto circuit boards.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this transistor can withstand high-temperature soldering processes without damage.

Technical Specifications

RF Power Field Effect Transistors (FET) MRF6VP3450HR5 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

110 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-CDFM-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

225 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MRF6VP3450HR5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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