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MRF6VP2600HR6

NXP Semiconductors

MRF6VP2600HR6 by NXP Semiconductors

NXP Semiconductors' MRF6VP2600HR6 is a N-CHANNEL RF Power FET with 110V DS Breakdown Voltage, ideal for AMPLIFIER applications in the ULTRA HIGH FREQUENCY BAND. It features METAL-OXIDE SEMICONDUCTOR tech, operates at up to 225°C, and has a FLANGE MOUNT package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

MRF6VP2600HR6 by NXP Semiconductors
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Anansix

USA . 2,484 parts In-Stock

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2,484

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Digiode

USA . 2,047 parts In-Stock

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2,047

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Vyrian

USA . 785 parts In-Stock

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Nova Conductors

Japan . 45 parts In-Stock

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45

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AZTECH Wire

Italy . 607 parts In-Stock

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$16.802

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607

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One Stop Electronics

USA . 2,235 parts In-Stock

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$38.050

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$38.050

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Ampacity Inc.

Singapore . 672 parts In-Stock

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$65.050

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672

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Lixinc

USA . 15,407 parts In-Stock

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UNI Independent Distributors

Spain . 5,467 parts In-Stock

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Corphita

USA . 2,208 parts In-Stock

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Continental Prestige Electronics

USA . 2,049 parts In-Stock

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2,049

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Argo Parts USA

USA . 560 parts In-Stock

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560

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Overview

Unleash the power of cutting-edge technology with the MRF6VP2600HR6 RF Power Field Effect Transistor by NXP Semiconductors. This single-channel transistor offers unparalleled performance and reliability, making it the go-to choice for high-frequency amplifier applications. With a robust ceramic, metal-sealed co-fired package body and an operating temperature of up to 225°C, this transistor is built to withstand the most demanding conditions. Experience superior quality and unbeatable value with the MRF6VP2600HR6 - your ultimate solution for all your RF power needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package body material provides excellent thermal conductivity and reliability, making this FET suitable for high-power applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON resistance and higher efficiency compared to P-channel FETs, making this product a good choice for power amplifier applications.

Configuration: SINGLE

The single configuration simplifies the circuit design and makes integration into the system easier, reducing overall complexity and enhancing performance.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this FET provides high gain and low noise figures, ensuring optimal performance in amplification tasks.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost in production processes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides precise control over the FET, allowing for efficient power management and performance optimization.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high reliability, low power consumption, and fast switching speeds, making this FET suitable for high-frequency applications.

Maximum Operating Temperature: 225 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without performance degradation, ensuring reliable operation in harsh environments.

Technical Specifications

RF Power Field Effect Transistors (FET) MRF6VP2600HR6 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

ESD PROTECTED

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

110 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-CDFM-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

225 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MRF6VP2600HR6 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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