Loading...

PD55008S-E

STMicroelectronics

PD55008S-E by STMicroelectronics

STMicroelectronics PD55008S-E is an N-CHANNEL RF Power FET with 40V DS Breakdown Voltage and 4A Drain Current. Ideal for AMPLIFIER applications in ULTRA HIGH FREQUENCY BAND, it features a 52.8W Power Dissipation, SMALL OUTLINE package style, and operates at up to 165°C temperature.

Median Price

$10.710

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$10.710

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$10.710

-

-

-

Vyrian

USA . 5,413 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,413

-

-

-

-

Digiode

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,500

-

-

-

-

Anansix

USA . 908 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

908

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,573 parts In-Stock

1+ parts

$0.365

100+ parts

-

1k+ parts

$0.329

10k+ parts

-

1,573

$0.365

-

$0.329

-

Aztec Data Supply Inc.

USA . 4,895 parts In-Stock

1+ parts

$0.460

100+ parts

-

1k+ parts

-

10k+ parts

-

4,895

$0.460

-

-

-

MKK Technologies

India . 501 parts In-Stock

1+ parts

$0.687

100+ parts

-

1k+ parts

-

10k+ parts

-

501

$0.687

-

-

-

DigiPath Technology Company

USA . 501 parts In-Stock

1+ parts

$0.687

100+ parts

-

1k+ parts

-

10k+ parts

-

501

$0.687

-

-

-

Corohmni

South Africa . 405 parts In-Stock

1+ parts

$0.792

100+ parts

-

1k+ parts

-

10k+ parts

-

405

$0.792

-

-

-

Continental Prestige Electronics

USA . 6,242 parts In-Stock

1+ parts

$10.710

100+ parts

-

1k+ parts

-

10k+ parts

$10.496

6,242

$10.710

-

-

$10.496

AZTECH Wire

Italy . 762 parts In-Stock

1+ parts

$10.791

100+ parts

-

1k+ parts

-

10k+ parts

-

762

$10.791

-

-

-

Microchip USA

USA . 2,287 parts In-Stock

1+ parts

$30.458

100+ parts

-

1k+ parts

-

10k+ parts

-

2,287

$30.458

-

-

-

Ampacity Inc.

Singapore . 845 parts In-Stock

1+ parts

$40.050

100+ parts

-

1k+ parts

-

10k+ parts

-

845

$40.050

-

-

-

Semicontronic

India . 372 parts In-Stock

1+ parts

$61.050

100+ parts

$59.524

1k+ parts

$59.218

10k+ parts

-

372

$61.050

$59.524

$59.218

-

Component Stockers USA

USA . 224 parts In-Stock

1+ parts

$143.390

100+ parts

-

1k+ parts

-

10k+ parts

-

224

$143.390

-

-

-

Lixinc

USA . 9,025 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,025

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,261 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,261

-

-

-

-

Corphita

USA . 4,373 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,373

-

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$10.496

1k+ parts

$10.175

10k+ parts

$9.960

2,000

-

$10.496

$10.175

$9.960

Argo Parts USA

USA . 1,169 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,169

-

-

-

-

Perfect Parts

USA . 384 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

384

-

-

-

-

Parana Technologies

USA . 155 parts In-Stock

1+ parts

-

100+ parts

$0.437

1k+ parts

-

10k+ parts

-

155

-

$0.437

-

-

Overview

Experience high-quality performance and reliability with the PD55008S-E RF Power Field Effect Transistor by STMicroelectronics. As a leading manufacturer in semiconductor technology, STMicroelectronics delivers cutting-edge solutions for amplifier applications in the ultra high frequency band. With a maximum power dissipation of 52.8W and a minimum DS breakdown voltage of 40V, this N-channel transistor offers unmatched efficiency and power handling capabilities. Trust STMicroelectronics to provide top-notch products that excel in performance, making the PD55008S-E the perfect choice for your RF power amplification needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL polarity allows for efficient signal amplification and can handle higher power levels, making it suitable for amplifier applications.

Configuration: SINGLE

Single configuration simplifies the design and integration process, making it easier to incorporate this RF Power FET into various electronic systems.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance and power handling capabilities.

Surface Mount: YES

Surface mount capability makes it easier to mount the FET onto circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 40 V

A minimum breakdown voltage of 40 V ensures reliable operation and protection against voltage spikes or surges.

Terminal Form: FLAT

Flat terminals provide a stable connection and facilitate easy soldering during installation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for precise control of the transistor, enabling efficient signal amplification.

Maximum Drain Current (Abs) (ID): 4 A

With a maximum drain current of 4 A, this FET can handle high power levels and deliver reliable performance in various applications.

No. of Terminals: 2

Having only 2 terminals simplifies the circuit design and makes it easier to integrate into electronic systems.

Maximum Power Dissipation (Abs): 52.8 W

With a maximum power dissipation of 52.8 W, this FET can effectively dissipate heat and operate at high power levels without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and allows for compact system designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high efficiency and reliability, making this FET a durable and high-performance component.

Maximum Operating Temperature: 165 °C

With a maximum operating temperature of 165°C, this FET can withstand high temperatures and operate reliably in demanding environments.

Transistor Element Material: SILICON

Silicon material used in the transistor element ensures high performance, stability, and durability in various operating conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides excellent solderability and corrosion resistance, ensuring a reliable connection with other components.

Terminal Position: DUAL

Dual terminal position allows for flexible installation and connection options in different circuit configurations.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the FET has moderate sensitivity to moisture, ensuring reliability in normal operating conditions.

Case Connection: SOURCE

Source case connection simplifies the circuit design and provides a common point for grounding.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and assembly, contributing to the overall reliability of the product.

Peak Reflow Temperature °C: 250

With a peak reflow temperature of 250°C, this FET can withstand high-temperature soldering processes without compromising its performance.

Technical Specifications

RF Power Field Effect Transistors (FET) PD55008S-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD55008S-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20