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MRF9030LR1

NXP Semiconductors

MRF9030LR1 by NXP Semiconductors

NXP Semiconductors' MRF9030LR1 is a single N-channel RF Power FET with 68V DS breakdown voltage, ideal for amplifier applications in the UHF band. Featuring a max power dissipation of 92W and operating temperature up to 200°C, this MOSFET is designed for surface mount installation in high-frequency circuits.

Median Price

$35.380

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

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Digiode

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Anansix

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Chip Stock

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One Stop Electronics

USA . 1,620 parts In-Stock

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AZTECH Wire

Italy . 426 parts In-Stock

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Ampacity Inc.

Singapore . 631 parts In-Stock

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Continental Prestige Electronics

USA . 1,514 parts In-Stock

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Lixinc

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Argo Parts USA

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Authorized Procurement Solutions

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Corphita

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Microchip USA

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Glotronic Ltd.

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Overview

Unleash the power of innovation with the MRF9030LR1 RF Power Field Effect Transistor from NXP Semiconductors. Designed for ultra-high frequency applications, this single-channel amplifier boasts a breakthrough in performance and reliability. With a maximum power dissipation of 92W, this enhancement mode transistor offers unparalleled value to customers seeking cutting-edge technology. Trust NXP Semiconductors for quality products that deliver exceptional results in the most demanding environments. Elevate your projects with the MRF9030LR1 and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures good thermal performance and reliability of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher electron mobility, making them efficient for high frequency applications.

Configuration: SINGLE

The single configuration simplifies circuit design and allows for easier integration into amplifier systems.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in amplifying signals.

Surface Mount: YES

Surface mount capability allows for easy and efficient placement on circuit boards, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 68 V

The high minimum breakdown voltage ensures reliable operation and protection of the transistor in high voltage applications.

Package Shape: RECTANGULAR

Rectangular shape provides a compact form factor for space-constrained applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy control of the transistor's conductivity, improving efficiency in amplifier circuits.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for operation in the ultra-high frequency band, making it suitable for applications requiring high frequency performance.

Maximum Power Dissipation (Abs): 92 W

High maximum power dissipation allows for the transistor to handle high power levels without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and performance in RF power applications.

Maximum Operating Temperature: 200 °C

Ability to operate at up to 200°C ensures reliability in high temperature environments.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its reliability and performance in electronic devices.

Terminal Position: DUAL

Dual terminal position allows for easy connection to external circuits and components.

Case Connection: SOURCE

Source connection simplifies circuit design and improves signal integrity in amplifier applications.

Technical Specifications

RF Power Field Effect Transistors (FET) MRF9030LR1 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

68 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-CDFM-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MRF9030LR1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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