Loading...

MRF9030MBR1

NXP Semiconductors

MRF9030MBR1 by NXP Semiconductors

NXP's MRF9030MBR1 is an N-CHANNEL RF Power FET with 65V DS Breakdown Voltage, ideal for ULTRA HIGH FREQUENCY AMPLIFIER applications. It features a max power dissipation of 139W in a PLASTIC/EPOXY package style with FLANGE MOUNT and operates at up to 175°C.

Median Price

$22.590

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 39 parts In-Stock

1+ parts

-

100+ parts

$19.510

1k+ parts

$17.460

10k+ parts

$16.430

39

-

$19.510

$17.460

$16.430

DigiKey

USA . 39 parts In-Stock

1+ parts

-

100+ parts

$25.670

1k+ parts

-

10k+ parts

-

39

-

$25.670

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,910 parts In-Stock

1+ parts

$20.644

100+ parts

-

1k+ parts

-

10k+ parts

-

3,910

$20.644

-

-

-

Vyrian

USA . 7,215 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,215

-

-

-

-

Anansix

USA . 970 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

970

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 39 parts In-Stock

1+ parts

$18.470

100+ parts

-

1k+ parts

-

10k+ parts

-

39

$18.470

-

-

-

Corphita

USA . 3,368 parts In-Stock

1+ parts

$19.557

100+ parts

-

1k+ parts

-

10k+ parts

-

3,368

$19.557

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 24,025 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24,025

-

-

-

-

UNI Independent Distributors

Spain . 5,596 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,596

-

-

-

-

Microchip USA

USA . 4,697 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,697

-

-

-

-

Continental Prestige Electronics

USA . 39 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

39

-

-

-

-

Overview

Experience unprecedented power and performance with the MRF9030MBR1 from NXP Semiconductors, a leading manufacturer in RF Power Field Effect Transistors. This single-channel amplifier delivers unrivaled quality and reliability for ultra-high frequency applications. With a maximum power dissipation of 139 W and a minimum DS breakdown voltage of 65 V, this enhancement mode transistor offers customers exceptional value and efficiency. Elevate your projects to new heights with the MRF9030MBR1 and unleash the full potential of your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides both durability and lightweight properties, making the transistor easy to handle and install in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-state resistance and higher electron mobility compared to P-channel FETs, resulting in better overall performance.

Configuration: SINGLE

A single configuration simplifies the design and integration process, making it easier to incorporate this transistor into circuits.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance and efficiency in amplifying RF signals.

Surface Mount: YES

Surface mount capability allows for easy and compact integration onto circuit boards, saving space and simplifying manufacturing processes.

Minimum DS Breakdown Voltage: 65 V

The high breakdown voltage ensures reliability and protection against potential voltage spikes or surges in the circuit.

Maximum Power Dissipation (Abs): 139 W

With a high power dissipation rating, this transistor can handle large amounts of power without overheating, making it ideal for high-power applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows the transistor to withstand elevated temperatures, ensuring stable performance under demanding conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology offers high efficiency and low ON-state resistance, contributing to improved overall performance of the transistor.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering during manufacturing, guaranteeing strong connections and longevity of the product.

Technical Specifications

RF Power Field Effect Transistors (FET) MRF9030MBR1 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-272

JESD-30 Code:

R-PDFM-F2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MRF9030MBR1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20