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LET9002

STMicroelectronics

LET9002 by STMicroelectronics

LET9002 by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 4 A, a breakdown voltage of 65 V, and operates in the ultra-high frequency band. This surface-mount transistor excels in enhancing performance while managing up to 4 W power dissipation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,545 parts In-Stock

1+ parts

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4,545

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Vyrian

USA . 4,329 parts In-Stock

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4,329

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Anansix

USA . 703 parts In-Stock

1+ parts

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703

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,516 parts In-Stock

1+ parts

$1.253

100+ parts

-

1k+ parts

$1.128

10k+ parts

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1,516

$1.253

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$1.128

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MKK Technologies

India . 1,285 parts In-Stock

1+ parts

$2.356

100+ parts

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1,285

$2.356

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DigiPath Technology Company

USA . 1,285 parts In-Stock

1+ parts

$2.356

100+ parts

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1,285

$2.356

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Parana Technologies

USA . 1,898 parts In-Stock

1+ parts

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100+ parts

$1.498

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1,898

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$1.498

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Corphita

USA . 534 parts In-Stock

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534

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Overview

Unlock superior performance with the LET9002 from STMicroelectronics, a trusted leader in RF technology. This N-channel FET is engineered for amplifying ultra-high frequency signals, offering reliability and efficiency in demanding applications. With its innovative design and robust construction, it ensures optimal power dissipation and minimal thermal impact, empowering your devices to deliver exceptional results while enhancing system longevity. Choose LET9002 for unmatched quality and performance in your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protection against environmental factors, making the product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically provide lower on-resistance and higher efficiency in switching applications, enhancing performance.

Configuration: SINGLE

A single configuration simplifies circuit design and helps reduce complexity in applications.

Transistor Application: AMPLIFIER

Designed specifically for amplification purposes, this transistor is ideal for audio and RF amplification applications.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly, which is advantageous for modern electronic devices.

Minimum DS Breakdown Voltage: 65 V

A minimum breakdown voltage of 65V allows for safe operation in high-voltage applications, providing reliability.

Package Shape: SQUARE

The square package shape facilitates efficient use of board space and improves thermal management.

Terminal Form: NO LEAD

Leadless terminal form offers advantages like reduced package size and improved electrical performance through shorter paths.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower gate drive requirements, improving efficiency in switching applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operating effectively in the ultra-high frequency band makes this FET suitable for high-speed communication applications.

Maximum Drain Current (Abs) (ID): 0.25 A

A maximum drain current of 0.25A allows this FET to handle moderate power levels, making it versatile for various applications.

No. of Terminals: 5

Five terminals provide versatility in circuit configuration and ease of integration into various designs.

Maximum Power Dissipation (Abs): 4 W

With a maximum power dissipation of 4W, this product can handle significant thermal loads, suitable for high-power applications.

Package Style (Meter): CHIP CARRIER

The chip carrier style enhances thermal performance and facilitates easy integration into dense circuit boards.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and fast switching speeds, making this FET ideal for digital and RF applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating of 150 °C ensures reliability in demanding environments, suitable for industrial applications.

Transistor Element Material: SILICON

Silicon provides good thermal conductivity and stability, ensuring consistent performance over a wide range of temperatures.

Maximum Drain Current (ID): 4 A

With a maximum drain current of 4A, this transistor can drive heavier loads, making it suitable for high power applications.

Terminal Position: QUAD

Quad terminal positioning allows for flexible layout designs on circuit boards, aiding in effective integration into systems.

Case Connection: SOURCE

Connecting the source to the case simplifies circuitry and enhances electrical performance by reducing inductive effects.

Technical Specifications

RF Power Field Effect Transistors (FET) LET9002 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

.25 A

Maximum Drain Current (ID):

4 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

S-PQCC-N5

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

4 W

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

LET9002 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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