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LET9060F

STMicroelectronics

LET9060F by STMicroelectronics

LET9060F by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 12 A, breakdown voltage of 80 V, and operates in the ultra-high frequency band. This surface-mount transistor ensures efficient performance with a max power dissipation of 130 W.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,611 parts In-Stock

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5,611

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Digiode

USA . 2,494 parts In-Stock

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2,494

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Anansix

USA . 2,451 parts In-Stock

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2,451

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 303 parts In-Stock

1+ parts

$1.663

100+ parts

-

1k+ parts

$1.497

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303

$1.663

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$1.497

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MKK Technologies

India . 2,167 parts In-Stock

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$3.128

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2,167

$3.128

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DigiPath Technology Company

USA . 2,167 parts In-Stock

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$3.128

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2,167

$3.128

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AZTECH Wire

Italy . 605 parts In-Stock

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$10.380

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605

$10.380

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Ampacity Inc.

Singapore . 1,080 parts In-Stock

1+ parts

$55.050

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1,080

$55.050

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Corphita

USA . 2,608 parts In-Stock

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2,608

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Parana Technologies

USA . 2,046 parts In-Stock

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$1.989

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2,046

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$1.989

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Perfect Parts

USA . 108 parts In-Stock

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108

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Overview

Elevate your projects with the LET9060F from STMicroelectronics, a leader in innovation and reliability. This N-channel RF power FET delivers exceptional performance for amplifiers in ultra-high frequency applications, ensuring robust power handling and efficiency. With its compact design and superior thermal management, it seamlessly integrates into modern systems, empowering you to achieve outstanding results while enjoying the trusted quality of STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers durability and cost-effectiveness, making this FET suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally provide higher electron mobility, leading to improved performance in amplifier applications.

Configuration: SINGLE

A single configuration contributes to simplicity in design and integration into circuits, facilitating easier handling and installation.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET excels in signal boosting applications, enhancing overall circuit performance.

Surface Mount: YES

Surface mount technology allows for compact designs and easier automation in manufacturing, leading to reduced assembly costs.

Minimum DS Breakdown Voltage: 80 V

A minimum breakdown voltage of 80 V ensures reliability in high-voltage applications, making it suitable for demanding electronic environments.

Package Shape: RECTANGULAR

The rectangular package shape is optimized for space savings on PCBs, allowing for efficient layout and design.

Terminal Form: FLAT

Flat terminals enable efficient thermal dissipation and provide a stable mechanical connection, enhancing overall reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for lower gate voltage operation, enabling faster switching speeds and better efficiency in applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operating in the ultra-high frequency band makes this FET suitable for advanced communication and RF applications, ensuring high performance.

Maximum Drain Current (Abs) (ID): 12 A

With a maximum drain current of 12 A, this transistor can effectively handle significant power loads, making it suitable for robust applications.

No. of Terminals: 2

Having only two terminals simplifies the circuit design, reducing complexity and potential points of failure.

Maximum Power Dissipation (Abs): 130 W

A high power dissipation capability of 130 W allows for extensive amplification without overheating, ensuring operational stability.

Package Style (Meter): FLATPACK

The flatpack style optimizes space on boards and enhances the thermal performance of the device, improving its efficiency.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Using MOS technology, this FET provides low gate-drive power and high input impedance, making it suitable for low-power applications.

Maximum Operating Temperature: 200 °C

A maximum operating temperature of 200 °C ensures reliable operation in high-heat environments, enhancing versatility in applications.

Transistor Element Material: SILICON

Silicon as the material provides excellent thermal stability and performance, making this FET reliable across a wide range of conditions.

Maximum Drain Current (ID): 12 A

This specification allows for consistent performance under load, ensuring that the FET can handle the needs of demanding applications.

Terminal Position: DUAL

Dual terminal positioning allows for flexible design options, accommodating various layout requirements.

Case Connection: SOURCE

A source connection establishes a reliable grounding point, essential for efficient circuit operation in amplifier setups.

Technical Specifications

RF Power Field Effect Transistors (FET) LET9060F attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDFP-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

LET9060F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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