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A5G26S004NT6

NXP Semiconductors

A5G26S004NT6 by NXP Semiconductors

RF Power Field-Effect Transistors; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;

Median Price

$16.810

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Richardson RFPD

USA . 197 parts In-Stock

1+ parts

$16.810

100+ parts

$11.710

1k+ parts

-

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197

$16.810

$11.710

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Distributors (In-Stock)

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Vyrian

USA . 8,219 parts In-Stock

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-

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8,219

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Flip Electronics

USA . 3,647 parts In-Stock

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3,647

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Anansix

USA . 2,052 parts In-Stock

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2,052

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Digiode

USA . 548 parts In-Stock

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548

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Distributors (Availability)

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Microchip USA

USA . 9,870 parts In-Stock

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$31.832

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9,870

$31.832

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UNI Independent Distributors

Spain . 4,491 parts In-Stock

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4,491

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Corphita

USA . 2,462 parts In-Stock

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2,462

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Northwest PG Solutions

USA . 541 parts In-Stock

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541

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Native Components

USA . 376 parts In-Stock

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376

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Technical Specifications

RF Power Field Effect Transistors (FET) A5G26S004NT6 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

A5G26S004NT6 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

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