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LET20015

STMicroelectronics

LET20015 by STMicroelectronics

LET20015 by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a 65V breakdown voltage, operates at up to 2A drain current, and supports L-band frequencies. Its compact surface mount design ensures efficient performance in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,969 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,969

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-

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Digiode

USA . 2,258 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,258

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Anansix

USA . 1,725 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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1,725

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 34 parts In-Stock

1+ parts

$0.734

100+ parts

-

1k+ parts

$0.661

10k+ parts

-

34

$0.734

-

$0.661

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MKK Technologies

India . 1,689 parts In-Stock

1+ parts

$1.381

100+ parts

-

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-

10k+ parts

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1,689

$1.381

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DigiPath Technology Company

USA . 1,689 parts In-Stock

1+ parts

$1.381

100+ parts

-

1k+ parts

-

10k+ parts

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1,689

$1.381

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Corphita

USA . 4,493 parts In-Stock

1+ parts

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4,493

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Parana Technologies

USA . 79 parts In-Stock

1+ parts

-

100+ parts

$0.878

1k+ parts

-

10k+ parts

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79

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$0.878

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Overview

Unlock new levels of performance with the LET20015 by STMicroelectronics, a top-tier RF Power FET designed for precision amplification in L-band applications. Renowned for its superior quality and reliability, STMicroelectronics ensures exceptional durability and efficiency, empowering your projects with robust power handling and thermal resilience. Elevate your designs with this compact, surface-mount solution that promises unmatched value and performance for cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials contributes to lightweight design and excellent thermal properties, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are typically faster and more efficient than P-channel devices, allowing for better performance in high-frequency applications.

Configuration: SINGLE

A single configuration simplifies circuit design and minimizes layout space, making it easier to integrate into existing systems.

Transistor Application: AMPLIFIER

Designed for amplifier applications, this FET provides high gain and linearity, making it an excellent choice for audio and RF amplification.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly processes, leading to shorter manufacturing times and lower costs.

Minimum DS Breakdown Voltage: 65 V

The breakdown voltage of 65 V ensures reliable operation in high-voltage applications, providing robust protection against voltage spikes.

Package Shape: RECTANGULAR

A rectangular package shape aids in efficient space utilization on PCBs, enabling better signal routing and minimizing interference.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability during soldering, ensuring reliable connections in demanding applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for efficient control and switching characteristics, enabling precise modulation in signal amplification.

Highest Frequency Band: L BAND

Designed for the L band, this FET is well-suited for various RF communication applications, including wireless and satellite communications.

Maximum Drain Current (Abs) (ID): 2 A

With a maximum drain current of 2 A, this FET can handle sufficient power levels for significant amplifier applications.

No. of Terminals: 2

The simplicity of a 2-terminal configuration reduces complexity in circuit design while ensuring effective functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style not only saves board space but also supports high-density applications, ideal for modern electronics.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures low power consumption and high input impedance, making it suitable for precision and low-noise applications.

Maximum Operating Temperature: 165 °C

A high maximum operating temperature of 165 °C ensures reliability and stability in harsh environments.

Transistor Element Material: SILICON

Silicon's excellent electronic properties make this FET reliable and efficient for a wide range of electronic devices.

Terminal Position: DUAL

Dual terminal positioning enhances mounting flexibility and facilitates easier routing on PCBs.

Case Connection: SOURCE

A source case connection design simplifies circuit integration and improves overall performance.

Technical Specifications

RF Power Field Effect Transistors (FET) LET20015 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

2 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

L BAND

JESD-30 Code:

R-PDSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

LET20015 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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