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LET21008

STMicroelectronics

LET21008 by STMicroelectronics

LET21008 by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a 65V breakdown voltage, operates at frequencies in the S band, and supports a max drain current of 2A. Ideal for high-performance surface mount designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,015 parts In-Stock

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1,015

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Anansix

USA . 466 parts In-Stock

1+ parts

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466

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Vyrian

USA . 58 parts In-Stock

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58

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 989 parts In-Stock

1+ parts

$1.091

100+ parts

-

1k+ parts

$0.982

10k+ parts

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989

$1.091

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$0.982

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MKK Technologies

India . 616 parts In-Stock

1+ parts

$2.052

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616

$2.052

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DigiPath Technology Company

USA . 616 parts In-Stock

1+ parts

$2.052

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616

$2.052

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Corphita

USA . 3,995 parts In-Stock

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3,995

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Parana Technologies

USA . 1,195 parts In-Stock

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$1.305

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1,195

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$1.305

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Overview

Unlock superior performance with the LET21008 by STMicroelectronics, a premier choice for RF power applications. Crafted from high-quality materials, this N-channel FET ensures reliability and efficiency, perfect for amplifying signals in demanding environments. With its compact design and advanced technology, it offers seamless integration into your projects while handling high frequencies with ease. Elevate your designs with ST's reputation for excellence and experience unparalleled value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making the FET reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher efficiency and better performance in amplifying signals, ideal for applications requiring strong output.

Configuration: SINGLE

Being a single configuration keeps the design simple and compact, suitable for space-constrained applications.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET is optimized to provide high gain and low distortion in signal processing.

Surface Mount: YES

Surface mount technology (SMT) allows for automated assembly and reduces the footprint, facilitating more densely packed circuit designs.

Minimum DS Breakdown Voltage: 65 V

A minimum breakdown voltage of 65V provides a good margin for high-voltage applications, enhancing reliability in varying conditions.

Package Shape: SQUARE

The square package shape allows for easier layout and efficient use of PCB space, contributing to compact circuit designs.

Terminal Form: NO LEAD

The no-lead terminal form enhances thermal performance and reduces the overall height of the device, making it suitable for low-profile applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers better control and higher efficiency, making it suitable for high-performance applications.

Highest Frequency Band: S BAND

Support for S band operation (2 to 4 GHz) makes this FET ideal for RF applications such as communications and radar systems.

Maximum Drain Current (Abs) (ID): 2 A

A maximum drain current of 2A allows this FET to handle moderate power levels, catering to a wide range of amplification applications.

No. of Terminals: 5

Five terminals provide necessary connections for proper functionality and flexibility in circuit design, allowing configuration as needed.

Package Style (Meter): CHIP CARRIER

Chip carrier package style is conducive to high-density mounting and provides efficient thermal management over traditional packages.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low power consumption, making it an excellent choice for modern electronic applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C ensures reliability and operation in high-temperature environments, which is critical for many applications.

Transistor Element Material: SILICON

Silicon as a transistor element material offers a good balance of performance, cost-effectiveness, and reliability, suitable for a range of uses.

Terminal Position: QUAD

Quad terminal configuration enables versatile layout options, providing better adaptability in different circuit designs.

Case Connection: SOURCE

Source case connection provides stable power delivery and enhances the efficiency of the overall circuit operation.

Technical Specifications

RF Power Field Effect Transistors (FET) LET21008 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

2 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

S BAND

JESD-30 Code:

S-PQCC-N5

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

LET21008 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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