Loading...

LET20030C

STMicroelectronics

LET20030C by STMicroelectronics

LET20030C by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 4 A, a breakdown voltage of 65 V, and operates in the L band. This surface-mount transistor supports high efficiency with a max temp of 200 °C.

Median Price

$62.485

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 42 parts In-Stock

1+ parts

$59.770

100+ parts

-

1k+ parts

-

10k+ parts

-

42

$59.770

-

-

-

Verical

USA . 42 parts In-Stock

1+ parts

$59.770

100+ parts

-

1k+ parts

-

10k+ parts

-

42

$59.770

-

-

-

Chip1Stop

Japan . 42 parts In-Stock

1+ parts

$65.200

100+ parts

-

1k+ parts

-

10k+ parts

-

42

$65.200

-

-

-

DigiKey

USA . 43 parts In-Stock

1+ parts

$81.850

100+ parts

$65.000

1k+ parts

-

10k+ parts

-

43

$81.850

$65.000

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 595 parts In-Stock

1+ parts

$56.782

100+ parts

-

1k+ parts

-

10k+ parts

-

595

$56.782

-

-

-

Bristol Electronics

USA . 43 parts In-Stock

1+ parts

$66.000

100+ parts

$55.849

1k+ parts

-

10k+ parts

-

43

$66.000

$55.849

-

-

Vyrian

USA . 7,764 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,764

-

-

-

-

Anansix

USA . 2,440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,440

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 43 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

43

-

-

-

-

Dan-Mar Components

USA . 43 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

43

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 935 parts In-Stock

1+ parts

$0.576

100+ parts

-

1k+ parts

$0.518

10k+ parts

-

935

$0.576

-

$0.518

-

MKK Technologies

India . 332 parts In-Stock

1+ parts

$1.083

100+ parts

-

1k+ parts

-

10k+ parts

-

332

$1.083

-

-

-

DigiPath Technology Company

USA . 332 parts In-Stock

1+ parts

$1.083

100+ parts

-

1k+ parts

-

10k+ parts

-

332

$1.083

-

-

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$2.315

100+ parts

$2.107

1k+ parts

$1.898

10k+ parts

-

2,000

$2.315

$2.107

$1.898

-

Corphita

USA . 623 parts In-Stock

1+ parts

$53.793

100+ parts

-

1k+ parts

-

10k+ parts

-

623

$53.793

-

-

-

Component Stockers USA

USA . 58 parts In-Stock

1+ parts

$58.610

100+ parts

-

1k+ parts

-

10k+ parts

-

58

$58.610

-

-

-

Microchip USA

USA . 158 parts In-Stock

1+ parts

$185.380

100+ parts

-

1k+ parts

-

10k+ parts

-

158

$185.380

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Parana Technologies

USA . 1,280 parts In-Stock

1+ parts

-

100+ parts

$0.689

1k+ parts

-

10k+ parts

-

1,280

-

$0.689

-

-

Perfect Parts

USA . 110 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

110

-

-

-

-

Overview

Elevate your RF applications with the LET20030C from STMicroelectronics, a leader in semiconductor innovation. This high-performance N-channel FET ensures robust amplification and exceptional power efficiency, making it ideal for demanding environments. With its reliable construction and advanced technology, you can trust in its durability and optimal performance. Experience the perfect blend of quality and value, empowering your projects to reach new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides good insulation and protection against environmental factors, making the transistor durable in a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer lower on-resistance and higher efficiency, making them ideal for applications in RF amplification where performance is critical.

Configuration: SINGLE

A single configuration simplifies the design and integration into circuits, reducing overall complexity and potential points of failure.

Transistor Application: AMPLIFIER

This transistor is specifically designed for amplification purposes, ensuring optimal performance in RF applications such as signal processing.

Surface Mount: YES

Being a surface mount device (SMD) allows for compact circuit designs and simplifies the manufacturing process, making it efficient for modern electronics.

Minimum DS Breakdown Voltage: 65 V

A minimum breakdown voltage of 65 V allows the transistor to handle high voltage applications, enhancing its versatility across different circuits.

Package Shape: RECTANGULAR

The rectangular package shape contributes to efficient space utilization on PCB layouts, facilitating better thermal management and easier assembly.

Terminal Form: FLAT

Flat terminals provide excellent contact with the PCB, minimizing parasitic inductance and resistance for improved signal integrity.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for a normally-off configuration, which helps reduce power consumption and enhances operational safety.

Highest Frequency Band: L BAND

The capability to operate in the L band makes this transistor suitable for a wide range of RF applications, including satellite communications and radar systems.

Maximum Drain Current (Abs) (ID): 4 A

A maximum drain current of 4 A supports higher power handling in RF applications, allowing for better signal amplification performance.

No. of Terminals: 2

Two terminals simplify the circuit design, providing ease in integration into various electronic systems.

Maximum Power Dissipation (Abs): 65 W

The capacity to dissipate up to 65 W of power means the transistor can handle substantial loads without overheating, ensuring reliability in high-performance applications.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging provides robust mechanical support and ensures stable placement on the PCB, enhancing overall reliability in operational environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology enables high input impedance and low power loss, making this device efficient in signal processing and reducing overall power consumption.

Maximum Operating Temperature: 200 °C

A high maximum operating temperature of 200 °C allows for use in challenging environments, improving application flexibility.

Transistor Element Material: SILICON

Silicon is a widely-used semiconductor material known for its excellent electrical properties, making it ideal for RF applications.

Maximum Drain Current (ID): 4 A

The specification reiterates that the transistor can handle significant currents, ensuring optimum performance in amplification tasks.

Terminal Position: DUAL

Dual terminal positioning aids in easier integration and wiring, contributing to a more efficient circuit layout.

Case Connection: SOURCE

Having the source as the case connection enhances thermal management by allowing for better heat dissipation during operation.

Technical Specifications

RF Power Field Effect Transistors (FET) LET20030C attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

L BAND

JESD-30 Code:

R-PDFM-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

LET20030C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 6