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LET20045C

STMicroelectronics

LET20045C by STMicroelectronics

LET20045C by STMicroelectronics is an N-CHANNEL RF Power FET with 80V DS Breakdown Voltage. It operates in Enhancement Mode for AMPLIFIER applications in L BAND frequency range. With 12A Drain Current and 130W Power Dissipation, it's a high-performance transistor suitable for various RF power amplification needs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,827 parts In-Stock

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4,827

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Digiode

USA . 4,152 parts In-Stock

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4,152

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Anansix

USA . 2,348 parts In-Stock

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2,348

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,224 parts In-Stock

1+ parts

$1.098

100+ parts

-

1k+ parts

$0.989

10k+ parts

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2,224

$1.098

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$0.989

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MKK Technologies

India . 561 parts In-Stock

1+ parts

$2.066

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-

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561

$2.066

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DigiPath Technology Company

USA . 561 parts In-Stock

1+ parts

$2.066

100+ parts

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561

$2.066

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AZTECH Wire

Italy . 186 parts In-Stock

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$18.230

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186

$18.230

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Corphita

USA . 2,336 parts In-Stock

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2,336

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Parana Technologies

USA . 173 parts In-Stock

1+ parts

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$1.313

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173

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$1.313

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Perfect Parts

USA . 45 parts In-Stock

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45

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Overview

Unleash the power of innovation with the LET20045C by STMicroelectronics, a top-of-the-line RF Power Field Effect Transistor. Designed for amplifiers in the L Band frequency range, this single-channel transistor offers unmatched performance and reliability. With a maximum power dissipation of 130W and a minimum DS breakdown voltage of 80V, this enhancement mode transistor is perfect for a wide range of applications. Trust in the quality and expertise of STMicroelectronics to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the LET20045C and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have higher electron mobility and lower ON resistance, resulting in improved performance in amplifier applications.

Configuration: SINGLE

Single configuration FETs are typically easier to control and handle, making them a reliable choice for amplifier circuits.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance and efficiency in amplification tasks.

Surface Mount: YES

Surface mount capability allows for easy and efficient mounting on circuit boards, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 80 V

With a minimum breakdown voltage of 80V, this FET can handle high voltage applications with ease, ensuring reliable operation.

Package Shape: RECTANGULAR

Rectangular shape provides a standard form factor for easy integration into existing systems and designs.

Terminal Form: FLAT

Flat terminals make it simple to connect and solder the FET onto a PCB, ensuring secure and reliable electrical connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy control of the FET's conductivity and performance, making it versatile for various amplifier applications.

Highest Frequency Band: L BAND

Designed for L Band frequencies, this FET is optimized for high-frequency applications in the L Band range for enhanced performance.

Maximum Drain Current (ID): 12 A

With a maximum drain current of 12A, this FET can handle high current loads, making it suitable for power amplifier applications.

Maximum Power Dissipation (Abs): 130 W

With a maximum power dissipation of 130W, this FET can efficiently handle power levels without overheating, ensuring reliable performance.

Package Style (Meter): FLANGE MOUNT

Flange mount package style allows for easy and secure mounting of the FET onto heat sinks or other surfaces for efficient heat dissipation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability for the FET, ensuring stable and consistent performance over time.

Maximum Operating Temperature: 200 °C

With a maximum operating temperature of 200 °C, this FET can withstand high-temperature environments, making it suitable for a wide range of applications.

Transistor Element Material: SILICON

Silicon material ensures excellent performance and reliability for the FET, making it a durable and long-lasting choice for amplifier circuits.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit design and connection options, making it suitable for various amplifier configurations.

Case Connection: SOURCE

Source connection allows for easy integration into amplifier circuits, ensuring reliable performance and stable operation.

Technical Specifications

RF Power Field Effect Transistors (FET) LET20045C attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

L BAND

JESD-30 Code:

R-PDFM-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

LET20045C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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