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LET21004

STMicroelectronics

LET21004 by STMicroelectronics

LET21004 by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a 65V breakdown voltage, operates at frequencies in the S band, and supports a max drain current of 1A. Ideal for compact surface mount designs, it excels in high-temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,991 parts In-Stock

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1,991

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Anansix

USA . 678 parts In-Stock

1+ parts

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678

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Vyrian

USA . 103 parts In-Stock

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103

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,094 parts In-Stock

1+ parts

$1.178

100+ parts

-

1k+ parts

$1.060

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1,094

$1.178

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$1.060

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MKK Technologies

India . 1,878 parts In-Stock

1+ parts

$2.214

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1,878

$2.214

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DigiPath Technology Company

USA . 1,878 parts In-Stock

1+ parts

$2.214

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1,878

$2.214

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Corphita

USA . 4,767 parts In-Stock

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4,767

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Parana Technologies

USA . 1,662 parts In-Stock

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$1.408

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1,662

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$1.408

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Overview

Elevate your designs with the LET21004 by STMicroelectronics, a premier choice in RF Power FETs that delivers unmatched performance and reliability. Renowned for their commitment to quality, STMicroelectronics ensures this N-channel amplifier enhances signal clarity while operating efficiently under demanding conditions. Whether for communications or consumer electronics, the LET21004 empowers engineers to innovate confidently, driving excellence in every application. Experience superior value and performance with ST's trusted technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, contributing to the longevity of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer higher electron mobility, leading to better performance in amplification applications.

Configuration: SINGLE

A single configuration simplifies design and integration into circuits, making it easier for engineers to implement.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET is optimized for high gain and efficiency in signal processing.

Surface Mount: YES

Surface mount capability allows for compact designs and more efficient use of board space, catering to modern electronic designs.

Minimum DS Breakdown Voltage: 65 V

A high breakdown voltage provides reliability in high-voltage applications, ensuring stable operation under varying conditions.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space and provides a stable mounting option.

Terminal Form: NO LEAD

No lead design enhances thermal performance and reduces inductance, promoting stability at high frequencies.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for increased flexibility and performance in amplifiers, as it enables control of operational characteristics.

Highest Frequency Band: S BAND

S-band capability lets this FET be used in a range of applications, including communications, radar, and other RF functions.

Maximum Drain Current (Abs) (ID): 1 A

A maximum drain current of 1 A allows this FET to be suitable for a wide range of applications without overheating.

No. of Terminals: 5

Five terminals provide sufficient connectivity while maintaining a compact design, allowing for organized circuit integration.

Package Style (Meter): CHIP CARRIER

The chip carrier package style enhances heat dissipation and supports effective performance in compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high input impedance and low power consumption, ideal for efficient amplification and signal processing.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures reliability and performance in demanding environments, suited for various industrial applications.

Transistor Element Material: SILICON

Silicon is a well-established material in semiconductor technology, providing stability and performance across a range of temperatures and conditions.

Maximum Drain Current (ID): 1 A

This specification indicates robust performance under load, ensuring the device can handle demanding amplification tasks.

Terminal Position: QUAD

Quad terminal positioning allows for optimized layout options on PCB, promoting effective connectivity and reduced interference.

Case Connection: SOURCE

Connecting the case to the source helps with thermal management, improving device performance and reliability during operation.

Technical Specifications

RF Power Field Effect Transistors (FET) LET21004 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

1 A

Maximum Drain Current (ID):

1 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

S BAND

JESD-30 Code:

S-PQCC-N5

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

LET21004 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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