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STAC2932B

STMicroelectronics

STAC2932B by STMicroelectronics

STAC2932B by STMicroelectronics is an N-channel RF power FET designed for ultra-high frequency applications. It features a max drain current of 40 A, breakdown voltage of 125 V, and can dissipate up to 625 W. Ideal for high-performance RF amplification in compact designs.

Median Price

$85.920

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 49 parts In-Stock

1+ parts

$85.920

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49

$85.920

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Verical

USA . 49 parts In-Stock

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$85.920

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49

$85.920

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Chip1Stop

Japan . 70 parts In-Stock

1+ parts

$87.000

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70

$87.000

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Distributors (In-Stock)

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Digiode

USA . 1,079 parts In-Stock

1+ parts

$80.702

100+ parts

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1,079

$80.702

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Vyrian

USA . 8,635 parts In-Stock

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8,635

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Anansix

USA . 390 parts In-Stock

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390

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,808 parts In-Stock

1+ parts

$0.924

100+ parts

-

1k+ parts

$0.831

10k+ parts

-

1,808

$0.924

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$0.831

-

MKK Technologies

India . 1,333 parts In-Stock

1+ parts

$1.737

100+ parts

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1,333

$1.737

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DigiPath Technology Company

USA . 1,333 parts In-Stock

1+ parts

$1.737

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1,333

$1.737

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Advanced Electronics

New Zealand . 700 parts In-Stock

1+ parts

$1.907

100+ parts

$1.735

1k+ parts

$1.564

10k+ parts

-

700

$1.907

$1.735

$1.564

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AZTECH Wire

Italy . 611 parts In-Stock

1+ parts

$14.850

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611

$14.850

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Corphita

USA . 2,044 parts In-Stock

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$76.455

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2,044

$76.455

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Component Stockers USA

USA . 214 parts In-Stock

1+ parts

$98.890

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214

$98.890

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Parana Technologies

USA . 836 parts In-Stock

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$1.104

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836

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$1.104

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Perfect Parts

USA . 18 parts In-Stock

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Overview

Unlock the potential of your designs with the STAC2932B from STMicroelectronics, a leader in innovative semiconductor solutions. This state-of-the-art N-channel RF Power FET delivers exceptional performance in ultra-high frequency applications, ensuring robust signal integrity and reliability. Its ceramic-metal sealed packaging offers superior thermal management, making it ideal for demanding environments. Elevate your projects with the unmatched quality and efficiency that only STMicroelectronics can provide!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed materials enhances durability and thermal stability, making this FET suitable for high-performance applications.

Polarity or Channel Type: N-CHANNEL

N-channel configuration allows for better efficiency and higher speed in switching applications, making it ideal for RF power applications.

Configuration: SINGLE

A single configuration simplifies design and integration, allowing for easier implementation in various circuits.

Surface Mount: YES

Surface mount capability allows for compact design and automated assembly, reducing manufacturing costs and enhancing performance.

Minimum DS Breakdown Voltage: 125 V

A high breakdown voltage of 125V provides robust protection against voltage spikes, ensuring reliability in demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape offers efficient space utilization on PCB layouts, facilitating easier integration into compact designs.

Terminal Form: FLAT

Flat terminals provide excellent thermal and electrical contact, enhancing device performance in high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better off-state control and lower power consumption, making it suitable for power-efficient designs.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra-high frequencies, this FET excels in applications that require rapid signal processing and high-frequency amplification.

Maximum Drain Current (Abs) (ID): 40 A

With a maximum drain current rating of 40 A, this FET can handle substantial power loads, making it suitable for high-performance RF applications.

No. of Terminals: 4

A 4-terminal setup enables more flexibility in circuit design and integration, allowing for specific configurations and applications.

Maximum Power Dissipation (Abs): 625 W

The high power dissipation capability (625 W) ensures reliable operation even under continuous high-load conditions, essential for power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for easy mounting to heatsinks and robust thermal management, enhancing the reliability of high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and fast switching capabilities, which are crucial for modern RF applications.

Maximum Operating Temperature: 200 °C

The ability to operate at temperatures up to 200 °C ensures reliable performance in high-temperature environments, making it ideal for various industrial applications.

Transistor Element Material: SILICON

Silicon as the transistor element material provides a good balance of performance, cost-effectiveness, and availability for a wide range of applications.

Maximum Drain Current (ID): 40 A

Reaffirming its high drain current handling, this feature supports efficient power management and allows for robust circuit designs.

Terminal Position: DUAL

Dual terminal positioning provides greater flexibility in layout design, enabling efficient placement in electronic circuits.

Case Connection: SOURCE

Source connection available improves circuit configuration options, allowing for optimized performance in various applications.

Technical Specifications

RF Power Field Effect Transistors (FET) STAC2932B attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

125 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-CDFM-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

STAC2932B Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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