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STAC3932B

STMicroelectronics

STAC3932B by STMicroelectronics

STAC3932B by STMicroelectronics is an N-channel RF power FET designed for ultra-high frequency applications. It features a max drain current of 20 A, breakdown voltage of 250 V, and power dissipation up to 625 W. Ideal for high-performance RF amplification in compact designs.

Median Price

$92.344

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 80 parts In-Stock

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80

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Bristol Electronics

USA . 12 parts In-Stock

1+ parts

$92.344

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12

$92.344

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Digiode

USA . 4,556 parts In-Stock

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4,556

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Vyrian

USA . 3,545 parts In-Stock

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Anansix

USA . 1,884 parts In-Stock

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1,884

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ACDS - Activité Composants Distribution Service

France . 12 parts In-Stock

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Dan-Mar Components

USA . 12 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 262 parts In-Stock

1+ parts

$1.052

100+ parts

-

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$0.947

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-

262

$1.052

-

$0.947

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MKK Technologies

India . 95 parts In-Stock

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$1.979

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$1.979

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DigiPath Technology Company

USA . 95 parts In-Stock

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$1.979

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95

$1.979

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AZTECH Wire

Italy . 271 parts In-Stock

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$17.870

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271

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Ampacity Inc.

Singapore . 80 parts In-Stock

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$63.050

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$63.050

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Microchip USA

USA . 6,855 parts In-Stock

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$176.962

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$176.962

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Component Stockers USA

USA . 19 parts In-Stock

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$1,765.650

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QUARKTWIN TECHNOLOGY LTD

USA . 16,348 parts In-Stock

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16,348

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Corphita

USA . 3,477 parts In-Stock

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3,477

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Perfect Parts

USA . 381 parts In-Stock

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381

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Parana Technologies

USA . 121 parts In-Stock

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$1.258

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121

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$1.258

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Overview

Experience cutting-edge performance with the STAC3932B from STMicroelectronics, a leader in innovation and reliability. This N-channel RF Power FET excels in high-frequency applications, delivering outstanding efficiency and power handling in a robust ceramic-metal sealed package. Ideal for telecommunications and broadcasting, its advanced technology ensures longevity and superior thermal management, empowering your designs with unmatched quality and cutting-edge capabilities.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This durable package material enhances reliability and reduces thermal stress, making it suitable for demanding RF applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs provide higher efficiency and better performance in high-speed switching applications, ideal for RF power amplification.

Configuration: SINGLE

A single configuration simplifies the design and integration into smaller form-factor applications, making it versatile for various RF systems.

Surface Mount: YES

Surface mount capability enables compact and efficient PCB designs, facilitating easier integration into modern electronic devices.

Minimum DS Breakdown Voltage: 250 V

A higher breakdown voltage makes this FET suitable for high-power RF applications, ensuring reliability under high voltage conditions.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space utilization on PCBs, allowing for better arrangement of components in RF systems.

Terminal Form: FLAT

Flat terminals enable excellent soldering and thermal contact, ensuring reliable connections and effective heat dissipation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode provides greater control over the device's operation, allowing for optimized performance in varying RF conditions.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra high frequency applications, this FET excels in performance in advanced RF and microwave communication systems.

Maximum Drain Current (Abs): 20 A

The ability to handle up to 20 A of drain current ensures strong performance under high-load conditions, suitable for power applications.

No. of Terminals: 4

Four terminals provide flexibility in circuit design and enhance connectivity options within various RF applications.

Maximum Power Dissipation (Abs): 625 W

High power dissipation capability allows for reliable operation in high-power situations, supporting robust and efficient RF systems.

Package Style (Meter): FLANGE MOUNT

Flange mount design facilitates easier mechanical fastening and better thermal conductivity, important for high-power RF devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides excellent switching speeds and high input impedance, critical for modern RF applications requiring rapid response.

Maximum Operating Temperature: 200 °C

With a high maximum temperature rating, this FET is built to operate in extreme conditions, ensuring reliability and longevity.

Transistor Element Material: SILICON

Silicon as the semiconductor material is universally recognized for its efficiency, reliability, and availability, making it a solid choice for RF applications.

Maximum Feedback Capacitance (Crss): 5.2 pF

Low feedback capacitance allows for faster response times and reduced signal distortion, making it ideal for high-frequency applications.

Technical Specifications

RF Power Field Effect Transistors (FET) STAC3932B attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

20 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5.2 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-CDFM-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

STAC3932B Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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