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STAC2932F

STMicroelectronics

STAC2932F by STMicroelectronics

STAC2932F by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 40 A, breakdown voltage of 125 V, and operates in the ultra-high frequency band. Its robust design supports high power dissipation up to 625 W.

Median Price

$86.490

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 75 parts In-Stock

1+ parts

$86.490

100+ parts

$68.750

1k+ parts

-

10k+ parts

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75

$86.490

$68.750

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,549 parts In-Stock

1+ parts

$81.795

100+ parts

-

1k+ parts

-

10k+ parts

-

1,549

$81.795

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-

-

Vyrian

USA . 5,885 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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5,885

-

-

-

-

Anansix

USA . 858 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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858

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 635 parts In-Stock

1+ parts

$0.615

100+ parts

-

1k+ parts

$0.553

10k+ parts

-

635

$0.615

-

$0.553

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$1.018

100+ parts

$0.926

1k+ parts

$0.835

10k+ parts

-

3,000

$1.018

$0.926

$0.835

-

MKK Technologies

India . 1,100 parts In-Stock

1+ parts

$1.156

100+ parts

-

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-

10k+ parts

-

1,100

$1.156

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-

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DigiPath Technology Company

USA . 1,100 parts In-Stock

1+ parts

$1.156

100+ parts

-

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10k+ parts

-

1,100

$1.156

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-

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Corphita

USA . 3,046 parts In-Stock

1+ parts

$77.490

100+ parts

-

1k+ parts

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10k+ parts

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3,046

$77.490

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-

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Microchip USA

USA . 340 parts In-Stock

1+ parts

$196.075

100+ parts

-

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340

$196.075

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QUARKTWIN TECHNOLOGY LTD

USA . 27,101 parts In-Stock

1+ parts

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100+ parts

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27,101

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Parana Technologies

USA . 2,243 parts In-Stock

1+ parts

-

100+ parts

$0.735

1k+ parts

-

10k+ parts

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2,243

-

$0.735

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-

Perfect Parts

USA . 90 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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90

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Overview

Unlock the power of innovation with the STAC2932F from STMicroelectronics, a leader in cutting-edge semiconductor solutions. This N-channel RF Power FET delivers unparalleled performance for ultra-high frequency applications, ensuring efficient amplification while boasting exceptional reliability and thermal stability. With STMicroelectronics' commitment to quality, you can trust the STAC2932F to enhance your designs, optimize energy usage, and drive success in your next project!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This durable packaging provides excellent thermal stability and reliability, allowing for consistent performance in demanding applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency, making this product ideal for high-performance amplifier applications.

Configuration: SINGLE

The single configuration simplifies circuit design, making it easier to integrate into various applications.

Transistor Application: AMPLIFIER

Designed specifically for amplification tasks, this FET excels in delivering high gain and excellent linearity.

Surface Mount: YES

Surface mount capability allows for compact PCB designs, ensuring space efficiency in modern electronic products.

Minimum DS Breakdown Voltage: 125 V

With a breakdown voltage of 125 V, this FET can operate safely in numerous high-voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape is efficient for layout and thermal management, making it versatile for different circuit designs.

Terminal Form: FLAT

Flat terminal design ensures better contact during soldering, improving reliability and performance in electronic assemblies.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide excellent control and make it effective for precision applications requiring higher input impedance.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capable of operating in the ultra-high frequency band, this device is perfect for applications requiring high-speed switching and operation.

Maximum Drain Current (Abs) (ID): 40 A

A maximum drain current rating of 40 A allows this FET to handle substantial power levels, ensuring robust performance under load.

No. of Terminals: 4

Four terminals enable versatile connections for various configurations and easier integration into complex circuits.

Maximum Power Dissipation (Abs): 625 W

Capable of dissipating 625 W, this FET is well-suited for high-power applications, maintaining efficiency and reliability.

Package Style (Meter): FLATPACK

The flatpack style promotes efficient heat dissipation and compact design, making it suitable for high-density electronic circuits.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high input impedance and fast switching speeds, making this device a great choice for modern RF applications.

Maximum Operating Temperature: 200 °C

With a high maximum operating temperature rating of 200 °C, this FET is suitable for environments with extreme thermal conditions.

Transistor Element Material: SILICON

Silicon as the material ensures reliable performance and good thermal conductivity, making this FET a dependable choice for various applications.

Maximum Drain Current (ID): 40 A

This repeated specification reiterates the robust current handling capability, ensuring sustained performance in demanding settings.

Terminal Position: DUAL

The dual terminal position allows for flexible routing on PCB layouts, accommodating a variety of design requirements.

Case Connection: SOURCE

The source connection ensures stable operation and enhances the FET's performance, particularly in amplifier configurations.

Technical Specifications

RF Power Field Effect Transistors (FET) STAC2932F attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

125 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-CDFP-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

STAC2932F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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