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STAC2942B

STMicroelectronics

STAC2942B by STMicroelectronics

STAC2942B by STMicroelectronics is an N-channel RF power FET designed for ultra-high frequency applications. It features a max drain current of 40 A, a breakdown voltage of 130 V, and can dissipate up to 625 W. Ideal for high-performance RF amplification in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,731 parts In-Stock

1+ parts

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3,731

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Vyrian

USA . 3,359 parts In-Stock

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3,359

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Anansix

USA . 552 parts In-Stock

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552

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$0.400

100+ parts

$0.396

1k+ parts

$0.380

10k+ parts

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500

$0.400

$0.396

$0.380

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IDEA Electronic Components Group

UK . 1,347 parts In-Stock

1+ parts

$1.700

100+ parts

-

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$1.530

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1,347

$1.700

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$1.530

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MKK Technologies

India . 1,582 parts In-Stock

1+ parts

$3.197

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1,582

$3.197

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DigiPath Technology Company

USA . 1,582 parts In-Stock

1+ parts

$3.197

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1,582

$3.197

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AZTECH Wire

Italy . 739 parts In-Stock

1+ parts

$17.870

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739

$17.870

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Corphita

USA . 3,912 parts In-Stock

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3,912

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Parana Technologies

USA . 1,306 parts In-Stock

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$2.033

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1,306

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$2.033

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Perfect Parts

USA . 1 parts In-Stock

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1

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Overview

Unlock the power of innovation with the STAC2942B from STMicroelectronics – a game-changer in RF Power FET technology. Known for their exceptional reliability and performance, STMicroelectronics delivers superior quality that translates into enhanced efficiency in ultra-high frequency applications. With its robust design, this N-channel transistor ensures seamless operation at high temperatures while supporting demanding power needs. Elevate your projects with cutting-edge solutions that drive success!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher electron mobility, enabling better performance in high-speed applications.

Configuration: SINGLE

A single configuration allows for compact design and simpler integration into circuits.

Surface Mount: YES

Surface mount technology saves space on PCBs and facilitates automated assembly.

Minimum DS Breakdown Voltage: 130 V

High breakdown voltage enhances reliability in demanding applications, making it suitable for high-voltage environments.

Package Shape: RECTANGULAR

Rectangular packaging can improve layout flexibility on circuit boards.

Terminal Form: FLAT

Flat terminal forms allow for better thermal conductivity and easier mounting.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a threshold voltage for operation, providing better control over power consumption.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Ability to operate in UHF ranges makes it suitable for RF applications such as telecommunications and broadcasting.

Maximum Drain Current (Abs) (ID): 40 A

A maximum drain current rating of 40 A enables the transistor to handle significant loads, ensuring reliability in high-power applications.

No. of Terminals: 4

Four terminals provide multiple connection options, enhancing circuit flexibility and integration.

Maximum Power Dissipation (Abs): 625 W

High power dissipation capability allows this FET to manage heat effectively, making it reliable in high-performance scenarios.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides robust mechanical support and thermal management options.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers advantages in power efficiency, making it ideal for modern applications.

Maximum Operating Temperature: 200 °C

A high maximum operating temperature means enhanced reliability and wider application scope in harsh environments.

Transistor Element Material: SILICON

Silicon is widely used for its excellent semiconductor properties, ensuring good performance and availability.

Maximum Drain Current (ID): 40 A

Redundant specification: supports high current applications, maintaining stable operation under load.

Terminal Position: DUAL

Dual terminal positions enhance the device's flexibility in circuit design, allowing for better layout options.

Case Connection: SOURCE

Direct source connection supports effective heat dissipation and simplifies circuit design.

Technical Specifications

RF Power Field Effect Transistors (FET) STAC2942B attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

130 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-XDFM-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

STAC2942B Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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