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LET9045

STMicroelectronics

LET9045 by STMicroelectronics

LET9045 by STMicroelectronics is an N-channel RF FET designed for amplifier applications, featuring a max drain current of 9 A and breakdown voltage of 80 V. It operates in the ultra-high frequency band with a power dissipation of up to 79 W. This compact surface mount device ensures efficient performance in demanding environments.

Median Price

$35.060

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 22 parts In-Stock

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$35.060

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22

$35.060

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Verical

USA . 22 parts In-Stock

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$35.060

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22

$35.060

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Chip1Stop

Japan . 22 parts In-Stock

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$37.100

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22

$37.100

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Distributors (In-Stock)

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Digiode

USA . 962 parts In-Stock

1+ parts

$33.307

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962

$33.307

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Vyrian

USA . 3,973 parts In-Stock

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3,973

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Anansix

USA . 869 parts In-Stock

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869

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Beltway Electronics Company

USA . 24 parts In-Stock

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24

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,444 parts In-Stock

1+ parts

$0.316

100+ parts

-

1k+ parts

$0.285

10k+ parts

-

1,444

$0.316

-

$0.285

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MKK Technologies

India . 1,456 parts In-Stock

1+ parts

$0.595

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1,456

$0.595

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DigiPath Technology Company

USA . 1,456 parts In-Stock

1+ parts

$0.595

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1,456

$0.595

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AZTECH Wire

Italy . 75 parts In-Stock

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$16.100

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75

$16.100

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Corphita

USA . 3,215 parts In-Stock

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$31.554

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3,215

$31.554

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Parana Technologies

USA . 1,676 parts In-Stock

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$0.378

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1,676

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$0.378

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Perfect Parts

USA . 821 parts In-Stock

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821

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Overview

Unlock the potential of your designs with the LET9045 from STMicroelectronics, a leader in cutting-edge technology. This robust RF power FET delivers exceptional performance, ensuring reliable amplification for ultra-high frequency applications. With its compact packaging and enhanced thermal management, it’s perfect for demanding environments. Experience superior efficiency and longevity, empowering your projects with unmatched quality and reliability that only STMicroelectronics can offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and lightweight characteristics, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer better electron mobility than P-channel, resulting in higher efficiency and faster switching speeds.

Configuration: SINGLE

A single configuration minimizes parasitic capacitance and enhances performance, making it ideal for compact designs.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this transistor is well-suited for applications requiring high signal integrity.

Surface Mount: YES

Surface mount technology allows for smaller PCB designs and automated assembly, reducing manufacturing costs.

Minimum DS Breakdown Voltage: 80 V

An 80 V breakdown voltage provides robust performance in high-voltage applications, ensuring reliability under demanding conditions.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on PCBs, facilitating denser designs without sacrificing performance.

Terminal Form: GULL WING

Gull wing terminal form ensures good mechanical stability and solderability, enhancing the reliability of connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for improved performance in digital circuits, enhancing the transistor's versatility.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Suitable for ultra-high frequency applications, it allows for high-speed communications and signal processing.

Maximum Drain Current (Abs) (ID): 9 A

With a maximum drain current of 9 A, this FET can handle significant loads, making it ideal for high power applications.

No. of Terminals: 2

The two-terminal design simplifies circuit integrations and minimizes component count, enhancing design efficiency.

Maximum Power Dissipation (Abs): 79 W

With a power dissipation capacity of 79 W, it is capable of handling considerable power without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style facilitates compact designs, making it perfect for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and stability, making this FET suitable for a wide range of applications.

Maximum Operating Temperature: 165 °C

A high maximum operating temperature (165 °C) ensures reliable performance in extreme conditions.

Transistor Element Material: SILICON

Silicon as the transistor material provides excellent thermal stability and improved electrical properties.

Terminal Finish: MATTE TIN

Matte tin terminal finish improves solderability and protects against oxidization, ensuring long-term reliability.

Maximum Drain Current (ID): 9 A

Reiterating the capability to handle high currents, reinforcing its suitability for robust applications.

Terminal Position: DUAL

Dual terminal positions aid in better routing and design flexibility on printed circuit boards.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, ensuring safe handling and storage in many environments.

Case Connection: SOURCE

The source case connection simplifies thermal management and improves reliability in distributed circuits.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow enables efficient soldering processes without compromising component integrity.

Peak Reflow Temperature °C: 250

A peak reflow temperature of 250 °C ensures compatibility with modern soldering techniques and materials.

Technical Specifications

RF Power Field Effect Transistors (FET) LET9045 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

9 A

Maximum Drain Current (ID):

9 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

LET9045 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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