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A3V26S004NT6

NXP Semiconductors

A3V26S004NT6 by NXP Semiconductors

N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Peak Reflow Temperature (C): 260; Operating Mode: ENHANCEMENT MODE;

Median Price

$4.240

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 53,086 parts In-Stock

1+ parts

-

100+ parts

$4.240

1k+ parts

$3.790

10k+ parts

$3.570

53,086

-

$4.240

$3.790

$3.570

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 904 parts In-Stock

1+ parts

$4.494

100+ parts

-

1k+ parts

-

10k+ parts

-

904

$4.494

-

-

-

Vyrian

USA . 7,925 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,925

-

-

-

-

Anansix

USA . 1,901 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,901

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 636 parts In-Stock

1+ parts

$0.249

100+ parts

-

1k+ parts

-

10k+ parts

$0.239

636

$0.249

-

-

$0.239

Northwest PG Solutions

USA . 1,448 parts In-Stock

1+ parts

$0.274

100+ parts

-

1k+ parts

-

10k+ parts

$0.242

1,448

$0.274

-

-

$0.242

Corphita

USA . 3,019 parts In-Stock

1+ parts

$4.257

100+ parts

-

1k+ parts

-

10k+ parts

-

3,019

$4.257

-

-

-

AZTECH Wire

Italy . 997 parts In-Stock

1+ parts

$16.310

100+ parts

-

1k+ parts

-

10k+ parts

-

997

$16.310

-

-

-

Microchip USA

USA . 4,239 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,239

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 3,866 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,866

-

-

-

-

UNI Independent Distributors

Spain . 3,128 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,128

-

-

-

-

Technical Specifications

RF Power Field Effect Transistors (FET) A3V26S004NT6 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

105 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

S BAND

JESD-30 Code:

R-PDSO-N6

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

225 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Minimum Power Gain (Gp):

19.5 dB

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

A3V26S004NT6 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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