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PD57006STR-E

STMicroelectronics

PD57006STR-E by STMicroelectronics

PD57006STR-E by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 1 A, a breakdown voltage of 65 V, and operates in the ultra-high frequency band. This compact surface-mount device ensures efficient performance up to 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,777 parts In-Stock

1+ parts

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4,777

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Vyrian

USA . 4,251 parts In-Stock

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4,251

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Anansix

USA . 2,330 parts In-Stock

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2,330

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,032 parts In-Stock

1+ parts

$0.788

100+ parts

-

1k+ parts

$0.710

10k+ parts

-

2,032

$0.788

-

$0.710

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MKK Technologies

India . 587 parts In-Stock

1+ parts

$1.483

100+ parts

-

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587

$1.483

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DigiPath Technology Company

USA . 587 parts In-Stock

1+ parts

$1.483

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587

$1.483

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AZTECH Wire

Italy . 507 parts In-Stock

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$9.140

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507

$9.140

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Component Stockers USA

USA . 299 parts In-Stock

1+ parts

$99.990

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299

$99.990

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Corphita

USA . 4,461 parts In-Stock

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4,461

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Parana Technologies

USA . 2,361 parts In-Stock

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$0.943

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2,361

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$0.943

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Perfect Parts

USA . 1,325 parts In-Stock

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1,325

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Overview

Elevate your projects with the PD57006STR-E from STMicroelectronics, a leading name in RF power FET technology. This N-channel transistor is designed for superior performance in ultra-high frequency applications, offering reliability and efficiency that stand out in the competitive market. With robust construction and exceptional power handling, it's perfect for amplifiers that demand quality and durability. Choose PD57006STR-E for peace of mind and unmatched value in your electronic designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, ensuring the longevity of the transistor in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer higher efficiency and faster switching speeds, making them ideal for high-performance amplifier applications.

Configuration: SINGLE

A single configuration simplifies design and integration, making it easy to implement in electronic circuits.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this FET ensures optimal signal amplification with minimal distortion.

Surface Mount: YES

Surface mount technology (SMT) allows for compact, efficient designs and automated assembly, facilitating mass production.

Minimum DS Breakdown Voltage: 65 V

A minimum breakdown voltage of 65 V enhances reliability in high-voltage applications, protecting against damage from overvoltage conditions.

Package Shape: RECTANGULAR

The rectangular shape is suitable for efficient use of PCB space and enables straightforward mounting in devices.

Terminal Form: FLAT

Flat terminals provide a stable and secure connection to the PCB, reducing the risk of mechanical failure.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption in standby and improved performance in active states.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

This FET's capability to operate in the ultra-high frequency band makes it suitable for advanced communication and RF applications.

Maximum Drain Current (Abs) (ID): 1 A

A maximum drain current of 1 A supports a wide range of applications while still providing room for safety margins in circuit design.

No. of Terminals: 2

With only two terminals, this FET simplifies circuit design and reduces the complexity of integration.

Maximum Power Dissipation (Abs): 20 W

A maximum power dissipation of 20 W allows for handling significant power levels, making it suitable for high-power applications.

Package Style (Meter): SMALL OUTLINE

The small outline packaging reduces board space usage, allowing for more compact and efficient electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high input impedance and low power consumption, enhancing efficiency in various electronic circuits.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C ensures reliable performance even in demanding thermal environments.

Transistor Element Material: SILICON

Silicon's excellent electrical properties contribute to the overall performance and reliability of this FET.

Terminal Finish: NICKEL PALLADIUM GOLD

This premium terminal finish enhances corrosion resistance and ensures reliable electrical connections over time.

Maximum Drain Current (ID): 1 A

Reiterating its capability to handle a maximum ID of 1 A emphasizes its robustness in circuit applications.

Terminal Position: DUAL

Dual terminal positions facilitate easier layout designs and flexibility in circuit connections.

Case Connection: SOURCE

The source connection design simplifies circuit configurations and enhances the overall performance of the FET in amplifying signals.

Technical Specifications

RF Power Field Effect Transistors (FET) PD57006STR-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

1 A

Maximum Drain Current (ID):

1 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e4

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD57006STR-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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