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PD57030STR-E

STMicroelectronics

PD57030STR-E by STMicroelectronics

PD57030STR-E by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 4 A, a breakdown voltage of 65 V, and operates in the ultra-high frequency band. This compact surface mount device ensures efficient performance with a max power dissipation of 52.8 W.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,838 parts In-Stock

1+ parts

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3,838

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Vyrian

USA . 3,001 parts In-Stock

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3,001

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Anansix

USA . 603 parts In-Stock

1+ parts

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603

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,513 parts In-Stock

1+ parts

$0.281

100+ parts

-

1k+ parts

$0.253

10k+ parts

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1,513

$0.281

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$0.253

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MKK Technologies

India . 682 parts In-Stock

1+ parts

$0.528

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682

$0.528

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DigiPath Technology Company

USA . 682 parts In-Stock

1+ parts

$0.528

100+ parts

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682

$0.528

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Corphita

USA . 2,797 parts In-Stock

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2,797

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Parana Technologies

USA . 2,064 parts In-Stock

1+ parts

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$0.336

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2,064

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$0.336

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Overview

Unleash the power of innovation with the PD57030STR-E from STMicroelectronics, a leader in semiconductor solutions. This premium RF Power FET is designed for superior performance in demanding applications, delivering unparalleled efficiency and reliability. Its compact surface-mount design ensures seamless integration into your projects, whether in amplifiers or communication systems. Experience enhanced thermal management and robust functionality, empowering your designs to excel like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the transistor reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors offer low on-resistance and higher efficiency, which is ideal for amplification purposes.

Configuration: SINGLE

Single configuration simplifies circuit design and integration, making it easier for engineers to work with.

Transistor Application: AMPLIFIER

Designed specifically for amplification, ensuring optimal performance in audio, radio frequency, and other signal processing applications.

Surface Mount: YES

Surface mount capability allows for compact designs and automated assembly processes, saving space on PCBs.

Minimum DS Breakdown Voltage: 65 V

A breakdown voltage of 65V provides a robust design that can handle high-voltage applications safely.

Package Shape: RECTANGULAR

Rectangular package shape is standard and facilitates easier layout in PCB design.

Terminal Form: FLAT

Flat terminals support better electrical contact and efficient heat dissipation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode offers lower power consumption and faster switching speeds, enhancing performance in many circuits.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Suitable for high-frequency applications, making this product ideal for modern communication technologies.

Maximum Drain Current (Abs): 4 A

With a capability of handling up to 4A, this FET can manage significant load currents, ensuring dependable operation.

No. of Terminals: 2

A two-terminal design simplifies connections and reduces complexity in circuit integration.

Maximum Power Dissipation (Abs): 52.8 W

High power dissipation of 52.8W makes this FET suitable for applications requiring significant power handling.

Package Style (Meter): SMALL OUTLINE

The small outline design helps to minimize the space required on a PCB, making it ideal for compact devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high-speed operations and low power consumption, valuable in modern electronic applications.

Maximum Operating Temperature: 165 °C

A high maximum operating temperature ensures reliability in demanding environments.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material, known for its excellent electrical properties and thermal stability.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and oxidation resistance, enhancing the longevity of the connection.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second limit at peak temperature allows for effective soldering without damaging the component.

Peak Reflow Temperature °C: 250

Withstanding peak temperatures of up to 250 °C ensures compatibility with standard reflow soldering processes.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates reliable moisture handling, suitable for various environmental conditions during manufacturing and storage.

Case Connection: SOURCE

Source connection simplifies the circuit design as it offers a clear return path for the current.

Technical Specifications

RF Power Field Effect Transistors (FET) PD57030STR-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD57030STR-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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