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PD57006-01

STMicroelectronics

PD57006-01 by STMicroelectronics

PD57006-01 by STMicroelectronics is an N-channel RF power FET designed for switching applications. It features a 65V breakdown voltage, operates at up to 1A drain current, and supports ultra-high frequency bands. Ideal for compact, high-performance circuits in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,776 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,776

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-

-

-

Vyrian

USA . 2,575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,575

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-

-

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Anansix

USA . 1,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,900

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 963 parts In-Stock

1+ parts

$0.794

100+ parts

-

1k+ parts

$0.715

10k+ parts

-

963

$0.794

-

$0.715

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MKK Technologies

India . 1,202 parts In-Stock

1+ parts

$1.493

100+ parts

-

1k+ parts

-

10k+ parts

-

1,202

$1.493

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-

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DigiPath Technology Company

USA . 1,202 parts In-Stock

1+ parts

$1.493

100+ parts

-

1k+ parts

-

10k+ parts

-

1,202

$1.493

-

-

-

Parana Technologies

USA . 1,985 parts In-Stock

1+ parts

-

100+ parts

$0.949

1k+ parts

-

10k+ parts

-

1,985

-

$0.949

-

-

Corphita

USA . 770 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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770

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Overview

Elevate your designs with the PD57006-01 from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance RF Power FET delivers unparalleled efficiency for your switching applications, ensuring reliability and longevity in even the most demanding environments. With its compact surface-mount design and robust thermal capabilities, it’s perfect for ultra-high frequency applications, allowing you to maximize performance while minimizing space. Trust STMicroelectronics to empower your next breakthrough!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body enhances durability and resistance to environmental factors, making it suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically provide higher efficiency and faster switching speeds, making them ideal for power applications.

Configuration: SINGLE

A single configuration allows for simplified design and integration into circuits, making it a convenient choice for engineers.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast and reliable performance in digital and analog circuits.

Surface Mount: YES

Surface mount technology facilitates compact designs, enhances circuit density, and simplifies the assembly process.

Minimum DS Breakdown Voltage: 65 V

With a breakdown voltage of 65V, this FET can handle higher voltage applications, providing design flexibility and safety.

Package Shape: SQUARE

The square package shape optimizes space on the PCB and allows for consistent performance in various orientations.

Terminal Form: NO LEAD

No lead configuration helps in reducing parasitic inductance and capacitance, improving overall performance in high-frequency applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for devices to be turned off when no voltage is applied, providing better control and reducing power consumption.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra high frequency applications, this FET allows for high-speed performance, making it suitable for RF applications.

Maximum Drain Current (Abs) (ID): 1 A

A maximum drain current of 1A delivers ample power handling capability for many common applications.

No. of Terminals: 12

With 12 terminals, this transistor provides flexibility for complex circuit designs and multiple connection options.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging allows for efficient heat dissipation and improved performance in electronic circuits.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low power consumption, making this FET ideal for low-power applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C signifies robustness under extreme conditions, extending product lifespan.

Transistor Element Material: SILICON

Silicon is widely used in semiconductor technology, ensuring reliability and efficiency in various electronic applications.

Terminal Position: QUAD

Quad terminal positioning allows for versatile layout options in PCB design, enhancing the design's adaptability.

Case Connection: SOURCE

Direct source connection facilitates easy integration into circuits and ensures stable operation under varying conditions.

Technical Specifications

RF Power Field Effect Transistors (FET) PD57006-01 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

1 A

Maximum Drain Current (ID):

1 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

S-PQCC-N12

No. of Elements:

1

No. of Terminals:

12

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

PD57006-01 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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