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A2T21H140-24SR3

NXP Semiconductors

A2T21H140-24SR3 by NXP Semiconductors

RF Power Field-Effect Transistors; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;

Median Price

$62.605

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 105 parts In-Stock

1+ parts

$82.000

100+ parts

$66.600

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105

$82.000

$66.600

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Rochester

USA . 760 parts In-Stock

1+ parts

-

100+ parts

$43.210

1k+ parts

$38.660

10k+ parts

$36.380

760

-

$43.210

$38.660

$36.380

Verical

USA . 105 parts In-Stock

1+ parts

-

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105

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-

Distributors (In-Stock)

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Digiode

USA . 1,903 parts In-Stock

1+ parts

$45.724

100+ parts

-

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1,903

$45.724

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Vyrian

USA . 8,053 parts In-Stock

1+ parts

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8,053

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Anansix

USA . 1,648 parts In-Stock

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1,648

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Flip Electronics

USA . 234 parts In-Stock

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234

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 827 parts In-Stock

1+ parts

$1.404

100+ parts

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827

$1.404

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Northwest PG Solutions

USA . 1,796 parts In-Stock

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$1.544

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1,796

$1.544

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Corphita

USA . 4,874 parts In-Stock

1+ parts

$43.317

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4,874

$43.317

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UNI Independent Distributors

Spain . 7,197 parts In-Stock

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7,197

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Technical Specifications

RF Power Field Effect Transistors (FET) A2T21H140-24SR3 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Peak Reflow Temperature (C):

260

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

A2T21H140-24SR3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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