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PD54008STR-E

STMicroelectronics

PD54008STR-E by STMicroelectronics

PD54008STR-E by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 5 A, a breakdown voltage of 25 V, and operates in the ultra-high frequency band. This compact surface mount transistor ensures efficient performance up to 165 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,794 parts In-Stock

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3,794

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Digiode

USA . 3,609 parts In-Stock

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3,609

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Anansix

USA . 1,966 parts In-Stock

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1,966

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,628 parts In-Stock

1+ parts

$1.423

100+ parts

-

1k+ parts

$1.281

10k+ parts

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1,628

$1.423

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$1.281

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MKK Technologies

India . 448 parts In-Stock

1+ parts

$2.676

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448

$2.676

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DigiPath Technology Company

USA . 448 parts In-Stock

1+ parts

$2.676

100+ parts

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448

$2.676

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Corphita

USA . 2,342 parts In-Stock

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2,342

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Parana Technologies

USA . 1,946 parts In-Stock

1+ parts

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$1.702

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1,946

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$1.702

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Overview

Unlock superior performance in your RF applications with the PD54008STR-E from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a single N-channel FET designed to amplify signals with exceptional efficiency. Ideal for ultra-high frequency usage, this compact powerhouse ensures reliable operation in demanding environments, offering you unmatched value and performance that enhances your designs and reduces overall costs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for higher efficiency and improved speed when utilized in amplification applications, which enhances overall circuit performance.

Configuration: SINGLE

A single configuration simplifies the circuit design, making it ideal for compact applications with less component count.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimized performance for signal amplification and high fidelity.

Surface Mount: YES

Surface mount technology allows for smaller PCB designs, facilitating a more compact and efficient usage of space in electronic devices.

Minimum DS Breakdown Voltage: 25 V

A minimum breakdown voltage of 25 V ensures robust operation in high-voltage applications, contributing to device reliability.

Package Shape: RECTANGULAR

The rectangular package shape offers efficient space utilization on PCBs, making it versatile for various layouts.

Terminal Form: FLAT

Flat terminal form promotes excellent thermal management and electrical connections, essential for enhancing performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for the transistor to be 'turned off' when not in use, leading to power savings and efficiency.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capable of operating in the ultra high frequency band, making it suitable for advanced communication and RF applications.

Maximum Drain Current (Abs) (ID): 5 A

A maximum drain current of 5 A provides flexibility to handle various power requirements in amplifying circuits.

No. of Terminals: 2

Having only two terminals simplifies integration in circuit designs, making it easier to connect within various applications.

Maximum Power Dissipation (Abs): 73 W

With a maximum power dissipation of 73 W, this FET can manage high power levels, critical for demanding applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for efficient use of space, catering to compact electronic device design.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power loss, ensuring optimal performance in various applications.

Maximum Operating Temperature: 165 °C

Operating at a high temperature tolerance of 165 °C enhances reliability and performance in demanding environments.

Transistor Element Material: SILICON

Silicon as the element material is common in FETs, offering good conductivity and efficient performance characteristics.

Maximum Drain Current (ID): 5 A

Reiterated maximum drain current of 5 A ensures reliable performance under load, suitable for various high-power applications.

Terminal Position: DUAL

Dual terminal positioning enables a versatile range of mounting options, enhancing compatibility in design.

Case Connection: SOURCE

A source case connection simplifies the design while providing effective current flow management, critical in amplifier applications.

Technical Specifications

RF Power Field Effect Transistors (FET) PD54008STR-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD54008STR-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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