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PD54003-E

STMicroelectronics

PD54003-E by STMicroelectronics

STMicroelectronics' PD54003-E is an N-CHANNEL RF Power FET with 25V DS Breakdown Voltage. It operates in Enhancement Mode for AMPLIFIER applications in the ULTRA HIGH FREQUENCY BAND. With a max ID of 4A and 52.8W power dissipation, it's ideal for high-power RF amplification needs.

Median Price

$9.292

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 497 parts In-Stock

1+ parts

$11.317

100+ parts

$7.315

1k+ parts

$7.305

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-

497

$11.317

$7.315

$7.305

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Mouser Electronics

USA . 115 parts In-Stock

1+ parts

$11.950

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-

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115

$11.950

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Avnet

USA . 400 parts In-Stock

1+ parts

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400

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Arrow

USA . 400 parts In-Stock

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$7.268

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$6.341

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400

-

$7.268

$6.341

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Verical

USA . 400 parts In-Stock

1+ parts

-

100+ parts

$5.024

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-

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400

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$5.024

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$7.444

100+ parts

-

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50

$7.444

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Digiode

USA . 1,756 parts In-Stock

1+ parts

$10.751

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-

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1,756

$10.751

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Vyrian

USA . 7,715 parts In-Stock

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7,715

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Chip Stock

USA . 4,500 parts In-Stock

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4,500

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Anansix

USA . 972 parts In-Stock

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972

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,662 parts In-Stock

1+ parts

$0.563

100+ parts

-

1k+ parts

$0.507

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1,662

$0.563

-

$0.507

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Aztec Data Supply Inc.

USA . 1,259 parts In-Stock

1+ parts

$0.630

100+ parts

-

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1,259

$0.630

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Corohmni

South Africa . 143 parts In-Stock

1+ parts

$0.862

100+ parts

-

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143

$0.862

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MKK Technologies

India . 1,992 parts In-Stock

1+ parts

$1.059

100+ parts

-

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1,992

$1.059

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DigiPath Technology Company

USA . 1,992 parts In-Stock

1+ parts

$1.059

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1,992

$1.059

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Ampacity Inc.

Singapore . 183 parts In-Stock

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$5.150

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183

$5.150

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Semicontronic

India . 110 parts In-Stock

1+ parts

$5.150

100+ parts

$5.021

1k+ parts

$4.996

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110

$5.150

$5.021

$4.996

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$7.444

100+ parts

-

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$7.072

10k+ parts

$6.923

1,000

$7.444

-

$7.072

$6.923

Continental Prestige Electronics

USA . 486 parts In-Stock

1+ parts

$7.444

100+ parts

-

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$7.295

486

$7.444

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-

$7.295

Advanced Electronics

New Zealand . 25 parts In-Stock

1+ parts

$7.593

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$7.593

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$7.593

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25

$7.593

$7.593

$7.593

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Corphita

USA . 4,876 parts In-Stock

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$10.185

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$10.185

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Component Stockers USA

USA . 209 parts In-Stock

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$10.870

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$6.010

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209

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$6.010

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QUARKTWIN TECHNOLOGY LTD

USA . 20,577 parts In-Stock

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Microchip USA

USA . 9,864 parts In-Stock

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Argo Parts USA

USA . 1,074 parts In-Stock

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Parana Technologies

USA . 837 parts In-Stock

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$0.673

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837

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Perfect Parts

USA . 95 parts In-Stock

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Glotronic Ltd.

UK . 80 parts In-Stock

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Overview

Unlock the potential of high-performance RF amplification with the PD54003-E by STMicroelectronics. Crafted with precision and expertise, this N-CHANNEL RF Power Field Effect Transistor (FET) offers unparalleled reliability and efficiency in a compact, easy-to-install package. Ideal for applications in the ultra-high-frequency band, this enhancement mode transistor delivers a maximum power dissipation of 52.8W, making it a top choice for demanding amplifier setups. Elevate your projects with the quality and innovation that only STMicroelectronics can provide. Experience superior performance and lasting value with the PD54003-E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides good protection and insulation for the FET, ensuring reliable performance and longevity.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance characteristics compared to P-channel FETs, making this product a good choice for high-frequency applications.

Configuration: SINGLE

Single configuration FETs are straightforward to use and easier to integrate into electronic circuits, making this product a simple and efficient choice.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this FET is optimized for high gain and low noise operation, making it ideal for amplifying signals.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 25 V

The minimum breakdown voltage of 25V ensures reliable operation and protection against voltage spikes or surges.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact and organized layout, making it easier to fit into various electronic devices.

Terminal Form: GULL WING

The gull wing terminal form makes soldering and connection easier and more secure, ensuring stable performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the flow of current, allowing for precise and efficient operation in electronic circuits.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra-high frequency applications, this FET is optimized for fast signal processing and high-speed operation.

Maximum Drain Current (Abs) (ID): 4 A

With a maximum drain current of 4A, this FET can handle high power levels, making it suitable for demanding applications.

No. of Terminals: 2

Having only 2 terminals simplifies the circuit design and reduces complexity, making this FET easy to integrate into electronic systems.

Maximum Power Dissipation (Abs): 52.8 W

With a high maximum power dissipation of 52.8W, this FET can handle significant power levels without overheating or degradation.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on PCBs and allows for denser arrangements of components, ideal for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides good performance characteristics such as high input impedance and low leakage current, ensuring efficient operation.

Maximum Operating Temperature: 165 °C

With a maximum operating temperature of 165°C, this FET can withstand high-temperature environments, making it suitable for industrial and automotive applications.

Transistor Element Material: SILICON

Silicon-based FETs offer good performance characteristics, such as high breakdown voltage and low leakage current, ensuring reliable operation.

Terminal Position: DUAL

The dual terminal position allows for flexible connection options and simplifies circuit design, making this FET versatile and easy to use.

Case Connection: SOURCE

The source case connection simplifies the circuit layout and provides a common ground reference, ensuring stable and reliable operation.

Technical Specifications

RF Power Field Effect Transistors (FET) PD54003-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD54003-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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