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PD55035STR-E

STMicroelectronics

PD55035STR-E by STMicroelectronics

STMicroelectronics PD55035STR-E is an N-CHANNEL RF Power FET with 40V DS Breakdown Voltage, suitable for AMPLIFIER applications. It operates in ENHANCEMENT MODE at ULTRA HIGH FREQUENCY BAND, with 7A Drain Current and 95W Power Dissipation. Ideal for high-power RF amplification needs.

Median Price

$31.490

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 72 parts In-Stock

1+ parts

$31.490

100+ parts

-

1k+ parts

-

10k+ parts

-

72

$31.490

-

-

-

Vyrian

USA . 6,233 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,233

-

-

-

-

Digiode

USA . 965 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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965

-

-

-

-

Anansix

USA . 709 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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709

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 127 parts In-Stock

1+ parts

$0.719

100+ parts

-

1k+ parts

$0.647

10k+ parts

-

127

$0.719

-

$0.647

-

MKK Technologies

India . 1,724 parts In-Stock

1+ parts

$1.351

100+ parts

-

1k+ parts

-

10k+ parts

-

1,724

$1.351

-

-

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DigiPath Technology Company

USA . 1,724 parts In-Stock

1+ parts

$1.351

100+ parts

-

1k+ parts

-

10k+ parts

-

1,724

$1.351

-

-

-

AZTECH Wire

Italy . 190 parts In-Stock

1+ parts

$19.021

100+ parts

-

1k+ parts

-

10k+ parts

-

190

$19.021

-

-

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Continental Prestige Electronics

USA . 3,321 parts In-Stock

1+ parts

$31.490

100+ parts

-

1k+ parts

-

10k+ parts

$30.860

3,321

$31.490

-

-

$30.860

Ampacity Inc.

Singapore . 1,566 parts In-Stock

1+ parts

$60.050

100+ parts

-

1k+ parts

-

10k+ parts

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1,566

$60.050

-

-

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Corphita

USA . 4,157 parts In-Stock

1+ parts

-

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4,157

-

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Argo Parts USA

USA . 3,079 parts In-Stock

1+ parts

-

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3,079

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-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$30.860

1k+ parts

$29.915

10k+ parts

$29.286

1,000

-

$30.860

$29.915

$29.286

Parana Technologies

USA . 357 parts In-Stock

1+ parts

-

100+ parts

$0.859

1k+ parts

-

10k+ parts

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357

-

$0.859

-

-

Overview

Unleash the power of innovation with the PD55035STR-E from STMicroelectronics. This RF Power Field Effect Transistor combines cutting-edge technology with reliable performance, making it the perfect choice for amplifier applications in the ultra-high frequency band. With a maximum power dissipation of 95W and a minimum DS breakdown voltage of 40V, this transistor offers unmatched value and versatility. Trust in the quality and expertise of STMicroelectronics to deliver superior products that exceed your expectations. Elevate your designs with the PD55035STR-E and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower on-resistance and higher current capabilities compared to P-channel transistors.

Transistor Application: AMPLIFIER

Designed specifically for amplification purposes, ensuring high performance in amplification applications.

Minimum DS Breakdown Voltage: 40 V

Capable of handling voltages up to 40V, making it suitable for a wide range of applications.

Surface Mount: YES

Enables easy and efficient mounting on circuit boards, saving space and simplifying assembly.

Maximum Drain Current (ID): 7 A

Can handle high current levels, making it suitable for power amplifier applications.

Maximum Power Dissipation (Abs): 95 W

Capable of dissipating up to 95W of power, ensuring reliable operation under high-power conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low on-resistance, resulting in efficient power handling.

Maximum Operating Temperature: 165 °C

Can operate at temperatures up to 165°C, suitable for high-temperature environments.

Technical Specifications

RF Power Field Effect Transistors (FET) PD55035STR-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD55035STR-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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