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PD55015

STMicroelectronics

PD55015 by STMicroelectronics

PD55015 by STMicroelectronics is an N-CHANNEL RF Power FET for AMPLIFIER applications. It operates in ENHANCEMENT MODE at ULTRA HIGH FREQUENCY, with a max drain current of 5A and power dissipation of 73W. The transistor has a PLASTIC/EPOXY body, GULL WING terminals, and can withstand up to 165°C operating temperature.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,187 parts In-Stock

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3,187

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Anansix

USA . 1,980 parts In-Stock

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1,980

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Vyrian

USA . 929 parts In-Stock

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929

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 299 parts In-Stock

1+ parts

$0.900

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-

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299

$0.900

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Corohmni

South Africa . 279 parts In-Stock

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$1.131

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279

$1.131

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IDEA Electronic Components Group

UK . 1,484 parts In-Stock

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$1.248

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$1.123

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$1.248

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$1.123

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MKK Technologies

India . 787 parts In-Stock

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$2.346

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787

$2.346

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DigiPath Technology Company

USA . 787 parts In-Stock

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$2.346

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787

$2.346

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Semicontronic

India . 1,599 parts In-Stock

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$11.050

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$10.774

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$10.718

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1,599

$11.050

$10.774

$10.718

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AZTECH Wire

Italy . 892 parts In-Stock

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$19.140

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892

$19.140

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Ampacity Inc.

Singapore . 836 parts In-Stock

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$46.050

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836

$46.050

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Continental Prestige Electronics

USA . 5,800 parts In-Stock

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Corphita

USA . 4,417 parts In-Stock

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Argo Parts USA

USA . 3,171 parts In-Stock

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Lixinc

USA . 2,443 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Parana Technologies

USA . 52 parts In-Stock

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$1.492

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52

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$1.492

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Assy Fe

Spain . 3 parts In-Stock

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Overview

Unlock superior performance with the PD55015 RF Power Field Effect Transistor from STMicroelectronics. Designed with cutting-edge technology, this N-CHANNEL transistor offers unparalleled reliability and efficiency for amplifier applications in the ultra-high-frequency band. With a maximum power dissipation of 73W and a minimum DS breakdown voltage of 40V, this transistor ensures optimal performance even in high-demand scenarios. Trust STMicroelectronics to deliver top-quality components that elevate your projects to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Allows for efficient amplification of signals in electronic circuits.

Configuration: SINGLE

Simplified design and ease of use for applications requiring a single transistor.

Transistor Application: AMPLIFIER

Specifically designed for amplifying signals with precision and accuracy.

Surface Mount: YES

Easy to mount on circuit boards, saving space and enabling efficient circuit design.

Minimum DS Breakdown Voltage: 40 V

Provides a high level of voltage protection, making it suitable for various applications.

Package Shape: RECTANGULAR

Compact design for easy integration into circuit layouts.

Terminal Form: GULL WING

Allows for easy soldering and connection in surface mount applications.

Operating Mode: ENHANCEMENT MODE

Enhances performance by allowing for precise control of the transistor's conductivity.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Ideal for applications requiring high-frequency signal processing.

Maximum Drain Current (Abs) (ID): 5 A

Capable of handling high current levels, making it suitable for power applications.

No. of Terminals: 2

Simple two-terminal connection for easy integration into circuits.

Maximum Power Dissipation (Abs): 73 W

Can handle high power dissipation levels, making it suitable for high-power applications.

Package Style (Meter): SMALL OUTLINE

Compact form factor for space-saving designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides efficient and reliable transistor performance.

Maximum Operating Temperature: 165 °C

Capable of operating in high-temperature environments, ensuring stability and performance.

Transistor Element Material: SILICON

Silicon-based material for high performance and reliability.

Terminal Finish: TIN LEAD

Provides a reliable and durable connection for the transistor.

Terminal Position: DUAL

Allows for versatile connection options in circuit designs.

Case Connection: SOURCE

Facilitates efficient signal amplification and processing in electronic circuits.

Technical Specifications

RF Power Field Effect Transistors (FET) PD55015 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD55015 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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