Loading...

SD56120M

STMicroelectronics

SD56120M by STMicroelectronics

SD56120M by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 14 A, a breakdown voltage of 65 V, and operates in the ultra-high frequency band. This surface-mount transistor excels in high-power environments with a max dissipation of 236 W.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,964 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,964

-

-

-

-

Vyrian

USA . 2,393 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,393

-

-

-

-

Anansix

USA . 2,266 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,266

-

-

-

-

Cyclops Electronics Ltd

UK . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3

-

-

-

-

Manotoh

Italy . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 480 parts In-Stock

1+ parts

$1.707

100+ parts

-

1k+ parts

$1.536

10k+ parts

-

480

$1.707

-

$1.536

-

MKK Technologies

India . 1,041 parts In-Stock

1+ parts

$3.209

100+ parts

-

1k+ parts

-

10k+ parts

-

1,041

$3.209

-

-

-

DigiPath Technology Company

USA . 1,041 parts In-Stock

1+ parts

$3.209

100+ parts

-

1k+ parts

-

10k+ parts

-

1,041

$3.209

-

-

-

AZTECH Wire

Italy . 36 parts In-Stock

1+ parts

$17.110

100+ parts

-

1k+ parts

-

10k+ parts

-

36

$17.110

-

-

-

Component Stockers USA

USA . 778 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

778

$99.990

-

-

-

Parana Technologies

USA . 1,865 parts In-Stock

1+ parts

-

100+ parts

$2.040

1k+ parts

-

10k+ parts

-

1,865

-

$2.040

-

-

Corphita

USA . 1,211 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,211

-

-

-

-

Perfect Parts

USA . 65 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

65

-

-

-

-

Assy Fe

Spain . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6

-

-

-

-

Overview

Unlock superior performance with the SD56120M by STMicroelectronics, a leading name in RF power FET technology. Designed for ultimate efficiency and reliability, this N-channel enhancement mode transistor excels in amplifier applications across ultra-high frequency bands. With its robust construction and impressive thermal capabilities, it delivers outstanding power handling and longevity, making it the perfect choice for cutting-edge communication systems. Elevate your projects with ST's commitment to quality and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides excellent durability and protection against environmental factors, making the FET reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher efficiency and better performance in amplification applications compared to P-channel devices.

Configuration: COMMON SOURCE, 2 ELEMENTS

This configuration is well-suited for amplification purposes, allowing for high gain and low distortion in RF circuits.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET is ideal for enhancing signal quality in RF applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier automated placement on PCBs, saving space and reducing assembly costs.

Minimum DS Breakdown Voltage: 65 V

With a breakdown voltage of 65V, this FET can handle substantial voltage levels, increasing reliability in high voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient space utilization on PCBs and provides good thermal characteristics for heat dissipation.

Terminal Form: FLAT

Flat terminal design enhances the contact surface area, improving soldering quality and electrical connectivity in circuit assemblies.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides higher control over the transistor's ON and OFF states, leading to better efficiency and signal integrity.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Optimized for UHF applications, this FET can effectively operate at high frequencies, making it suitable for modern communication systems.

No. of Elements: 2

Having two active elements improves the overall performance in applications requiring higher power output and efficiency.

Maximum Drain Current (Abs) (ID): 14 A

With a maximum drain current of 14A, this FET can drive substantial loads, making it ideal for high-performance applications.

No. of Terminals: 4

Four terminals allow for versatile connections and increased design flexibility in circuit layouts.

Maximum Power Dissipation (Abs): 236 W

A maximum power dissipation of 236W indicates strong thermal handling capabilities, enhancing reliability in demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount design facilitates secure mounting and efficient heat dissipation, which is crucial for maintaining performance under load.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low power consumption, making it an excellent choice for RF applications.

Maximum Operating Temperature: 200 °C

Operating at temperatures up to 200 °C ensures reliability and performance stability in high-temperature environments.

Transistor Element Material: SILICON

Silicon is a standard material for FETs due to its excellent electronic properties and reliability in various applications.

Maximum Drain Current (ID): 14 A

Reiterating the ability to handle 14A signifies robust performance under significant electrical loads.

Terminal Position: DUAL

Dual terminal positioning allows for simplified routing on circuit boards and enhanced layout efficiency.

Case Connection: SOURCE

Having the case connection at the source helps in improved thermal management and operational efficiency within circuits.

Technical Specifications

RF Power Field Effect Transistors (FET) SD56120M attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

14 A

Maximum Drain Current (ID):

14 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDFM-F4

No. of Elements:

2

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

SD56120M Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 3