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CLF1G0035-50

NXP Semiconductors

CLF1G0035-50 by NXP Semiconductors

The NXP Semiconductors CLF1G0035-50 is an RF Power FET with a min DS Breakdown Voltage of 150V, operating in the S Band. It features Gallium Nitride technology, DEPLETION MODE, and is suitable for AMPLIFIER applications. The package style is FLANGE MOUNT with CERAMIC/METAL-SEALED COFIRED body material.

Median Price

$150.730

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,476 parts In-Stock

1+ parts

$150.730

100+ parts

$141.690

1k+ parts

$132.640

10k+ parts

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1,476

$150.730

$141.690

$132.640

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 49 parts In-Stock

1+ parts

$148.627

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49

$148.627

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Digiode

USA . 1,735 parts In-Stock

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$166.687

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1,735

$166.687

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Vyrian

USA . 3,641 parts In-Stock

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3,641

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Anansix

USA . 908 parts In-Stock

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908

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,100 parts In-Stock

1+ parts

$1.570

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$1.570

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AZTECH Wire

Italy . 845 parts In-Stock

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$17.801

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845

$17.801

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$145.654

100+ parts

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1k+ parts

$139.828

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100

$145.654

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$139.828

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Continental Prestige Electronics

USA . 355 parts In-Stock

1+ parts

$148.627

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$145.654

355

$148.627

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-

$145.654

Semicontronic

India . 136 parts In-Stock

1+ parts

$149.140

100+ parts

$145.412

1k+ parts

$144.666

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136

$149.140

$145.412

$144.666

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Ampacity Inc.

Singapore . 89 parts In-Stock

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$149.140

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89

$149.140

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Corphita

USA . 4,153 parts In-Stock

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$157.914

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4,153

$157.914

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Microchip USA

USA . 7,465 parts In-Stock

1+ parts

$160.780

100+ parts

$156.490

1k+ parts

$154.340

10k+ parts

$152.200

7,465

$160.780

$156.490

$154.340

$152.200

Lixinc

USA . 16,749 parts In-Stock

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16,749

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A-Z Elektronik GmbH

Germany . 7,047 parts In-Stock

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7,047

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Alle Elektronik GmbH

Germany . 4,698 parts In-Stock

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4,698

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UNI Independent Distributors

Spain . 4,021 parts In-Stock

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Argo Parts USA

USA . 4,003 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Overview

Upgrade your RF power amplifier with the CLF1G0035-50 by NXP Semiconductors. Known for their high-quality semiconductor products, NXP delivers reliable and efficient solutions for a variety of applications. This N-channel FET offers superior performance in the S band frequency range, making it ideal for amplification tasks. With a minimum breakdown voltage of 150V and a ceramic, metal-sealed package, this transistor ensures durability and long-lasting functionality. Elevate your projects with the CLF1G0035-50 and experience the value and benefits that NXP Semiconductors brings to the table.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures reliable performance and durability in different environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel type provides efficient operation and higher voltage handling capacity for improved overall performance.

Configuration: SINGLE

Single configuration simplifies the circuit design and enhances ease of use during integration.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimized amplification of RF signals.

Surface Mount: YES

Surface mount capability allows for easy PCB mounting, making installation and maintenance hassle-free.

Minimum DS Breakdown Voltage: 150 V

High breakdown voltage ensures reliable operation and protection against voltage spikes or surges.

Package Shape: RECTANGULAR

Rectangular package shape facilitates efficient PCB layout and compact integration in electronic devices.

Terminal Form: FLAT

Flat terminals provide stable connections and ease of soldering, ensuring secure electrical connections.

Operating Mode: DEPLETION MODE

Depletion mode operation offers precise control over the RF power output, leading to efficient signal amplification.

Highest Frequency Band: S BAND

S Band frequency range offers high-performance capabilities for applications requiring higher frequency signals.

No. of Terminals: 2

Two terminals simplify the connectivity and integration process, enhancing overall usability.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides secure mechanical mounting, ensuring stability during operation.

Field Effect Transistor Technology: HIGH ELECTRON MOBILITY

High electron mobility technology offers enhanced performance and efficiency in signal amplification applications.

Transistor Element Material: GALLIUM NITRIDE

Gallium nitride material provides superior power handling capabilities and improved RF signal amplification.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit design and connectivity options, enhancing versatility.

Case Connection: SOURCE

Source case connection ensures efficient power flow and stable operation during signal amplification.

Reference Standard: IEC-60134

Compliance with IEC-60134 standard ensures quality and reliability in performance, meeting industry standards.

Technical Specifications

RF Power Field Effect Transistors (FET) CLF1G0035-50 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

150 V

Field Effect Transistor Technology:

HIGH ELECTRON MOBILITY

Highest Frequency Band:

S BAND

JESD-30 Code:

R-CDFM-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

DEPLETION MODE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Reference Standard:

IEC-60134

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

GALLIUM NITRIDE

Trade Compliance

CLF1G0035-50 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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