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STAP1011-180

STMicroelectronics

STAP1011-180 by STMicroelectronics

STAP1011-180 by STMicroelectronics is an N-channel RF power FET designed for high-frequency applications in the L band. It features a max power dissipation of 800 W, a breakdown voltage of 65 V, and operates at temperatures up to 165 °C. Ideal for enhancing performance in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,667 parts In-Stock

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2,667

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Anansix

USA . 2,205 parts In-Stock

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2,205

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Vyrian

USA . 192 parts In-Stock

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192

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 496 parts In-Stock

1+ parts

$1.363

100+ parts

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$1.227

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496

$1.363

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$1.227

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MKK Technologies

India . 904 parts In-Stock

1+ parts

$2.564

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904

$2.564

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DigiPath Technology Company

USA . 904 parts In-Stock

1+ parts

$2.564

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904

$2.564

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Corphita

USA . 2,089 parts In-Stock

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2,089

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Parana Technologies

USA . 107 parts In-Stock

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$1.630

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107

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$1.630

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Overview

Unlock the potential of your RF applications with the STAP1011-180 from STMicroelectronics, a leading name in semiconductor innovation. This N-channel FET excels in delivering robust power performance and reliability, making it ideal for L-band communications and other demanding environments. With its superior thermal management and efficiency, you can achieve seamless operation while maximizing design flexibility. Choose STMicroelectronics for quality that elevates your projects to the next level!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body offers excellent durability and thermal performance, making it suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically provide better efficiency and higher performance in high-speed applications, making this transistor a strong choice for RF power applications.

Configuration: SINGLE

A single configuration in the FET leads to simplified design and low complexity in circuit integration, which is advantageous for efficient layout.

Surface Mount: YES

The surface mount capability allows for a compact design, facilitating higher density circuit layouts and improved manufacturing processes.

Minimum DS Breakdown Voltage: 65 V

A minimum breakdown voltage of 65V provides adequate protection against voltage spikes, ensuring reliability in operation.

Package Shape: RECTANGULAR

The rectangular shape of the package is conducive to efficient space utilization on PCBs, optimizing placement in high-density applications.

Terminal Form: FLAT

Flat terminals enhance soldering reliability and allow for better thermal management, important for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation typically results in lower power consumption when the device is off, making it suitable for energy-efficient applications.

Highest Frequency Band: L BAND

Operating in the L band allows the transistor to be used in various RF communication and radar applications, enhancing its versatility.

No. of Terminals: 4

With four terminals, this FET provides flexible connections and easier integration into various circuit designs.

Maximum Power Dissipation (Abs): 800 W

A maximum power dissipation rating of 800W indicates high thermal performance, making it suitable for demanding power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style ensures secure mounting and better thermal contact, aiding in effective heat dissipation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology contributes to the high efficiency and fast switching capabilities of the transistor, ideal for RF applications.

Maximum Operating Temperature: 165 °C

A high maximum operating temperature of 165 °C allows the device to operate effectively in harsh environments without risk of damage.

Transistor Element Material: SILICON

Silicon as the element material is standard for reliable performance and cost-effectiveness in semiconductor applications.

Terminal Position: DUAL

Dual terminal positioning allows for flexibility in PCB layout and enhances device performance by minimizing parasitic inductance.

Case Connection: SOURCE

A source connection in the case design allows for convenient integration into circuits, simplifying assembly and reducing layout complexity.

Technical Specifications

RF Power Field Effect Transistors (FET) STAP1011-180 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

L BAND

JESD-30 Code:

R-PDFM-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

STAP1011-180 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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