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STAP57030

STMicroelectronics

STAP57030 by STMicroelectronics

STAP57030 by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 4 A, a breakdown voltage of 65 V, and operates in the ultra-high frequency band. Its compact flange mount design ensures efficient performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,642 parts In-Stock

1+ parts

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3,642

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Anansix

USA . 2,538 parts In-Stock

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2,538

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Vyrian

USA . 1,432 parts In-Stock

1+ parts

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1,432

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 97 parts In-Stock

1+ parts

$1.812

100+ parts

-

1k+ parts

$1.631

10k+ parts

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97

$1.812

-

$1.631

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MKK Technologies

India . 578 parts In-Stock

1+ parts

$3.408

100+ parts

-

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578

$3.408

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DigiPath Technology Company

USA . 578 parts In-Stock

1+ parts

$3.408

100+ parts

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578

$3.408

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Corphita

USA . 3,705 parts In-Stock

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3,705

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Parana Technologies

USA . 163 parts In-Stock

1+ parts

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$2.167

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163

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$2.167

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Overview

Unlock the power of innovation with the STAP57030 from STMicroelectronics, a leader in semiconductor solutions. This N-channel RF Power FET is designed for superior amplification in ultra-high-frequency applications, ensuring unmatched performance and reliability. Crafted with precision, its advanced technology guarantees efficiency and durability, making it ideal for a wide range of electronic devices. Elevate your projects with a trusted partner that delivers quality and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good thermal stability and reliability, making this FET suitable for various demanding applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility, resulting in better performance and efficiency for amplification purposes.

Configuration: SINGLE

A single configuration allows for compact designs, making the FET easy to integrate into various circuits without requiring additional components.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET is ideal for use in audio, RF, and other signal processing applications where signal integrity is crucial.

Surface Mount: YES

Surface mount technology allows for automated assembly, smaller circuit boards, and improved performance due to shorter lead lengths.

Minimum DS Breakdown Voltage: 65 V

A minimum breakdown voltage of 65V ensures robustness in high-voltage applications where voltage spikes may occur.

Package Shape: RECTANGULAR

The rectangular shape aids in space-efficient layouts and is conducive for effective heat dissipation.

Terminal Form: FLAT

Flat terminals facilitate easier soldering and provide a stable mechanical connection, enhancing the overall assembly reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for higher efficiency and improved control of the transistor, particularly beneficial in amplifier applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Support for ultra high frequency makes this FET suitable for modern communication applications, providing excellent performance at high frequencies.

Maximum Drain Current (Abs) (ID): 4 A

With a maximum drain current of 4A, this FET can handle significant power levels, making it suitable for high-power applications.

No. of Terminals: 2

The simple two-terminal design simplifies circuit design and reduces the complexity in applications.

Maximum Power Dissipation (Abs): 52.8 W

A high power dissipation rating ensures that this FET can manage heat effectively, increasing its durability and reliability in high-performance applications.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides additional thermal management capabilities and is ideal for applications requiring robust mechanical stability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high input impedance and low power consumption, making this FET suitable for battery-powered and portable applications.

Maximum Operating Temperature: 165 °C

A high operating temperature tolerance of 165 °C allows this FET to perform in extreme environments, enhancing its versatility.

Transistor Element Material: SILICON

Silicon as the element material provides excellent electrical properties and physical robustness, making it the standard choice for reliable transistor operation.

Maximum Drain Current (ID): 4 A

With repeated emphasis on maximum drain current capabilities, this FET proves it can reliably manage high levels of current in various applications.

Terminal Position: DUAL

Dual terminal position allows for flexible design options and better layout optimization in circuit designs.

Case Connection: SOURCE

Source case connection enhances versatility for design and integration within various circuit configurations.

Technical Specifications

RF Power Field Effect Transistors (FET) STAP57030 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDFM-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

STAP57030 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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