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SD2931

STMicroelectronics

SD2931 by STMicroelectronics

SD2931 by STMicroelectronics is an N-channel RF power FET designed for ultra-high frequency applications. It features a max drain current of 20 A, a breakdown voltage of 125 V, and can dissipate up to 292 W. Ideal for high-performance amplification in communication systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,642 parts In-Stock

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3,642

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Anansix

USA . 2,090 parts In-Stock

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2,090

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Digiode

USA . 108 parts In-Stock

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108

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,071 parts In-Stock

1+ parts

$0.347

100+ parts

-

1k+ parts

$0.312

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2,071

$0.347

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$0.312

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MKK Technologies

India . 354 parts In-Stock

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$0.652

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354

$0.652

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DigiPath Technology Company

USA . 354 parts In-Stock

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$0.652

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354

$0.652

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AZTECH Wire

Italy . 462 parts In-Stock

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$16.860

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462

$16.860

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Component Stockers USA

USA . 783 parts In-Stock

1+ parts

$23.660

100+ parts

$22.470

1k+ parts

$21.760

10k+ parts

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783

$23.660

$22.470

$21.760

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Corphita

USA . 4,070 parts In-Stock

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4,070

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Parana Technologies

USA . 1,323 parts In-Stock

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$0.415

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1,323

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$0.415

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Perfect Parts

USA . 56 parts In-Stock

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Overview

Unlock unparalleled performance with the SD2931 RF Power FET from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for ultra-high frequency applications, this robust N-channel transistor delivers exceptional power handling and efficiency, ensuring your projects exceed expectations. With STMicroelectronics' commitment to quality and reliability, you gain not just a component, but a trusted partner in elevating your technology and enhancing operational success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy materials ensures durability and resistance to environmental factors, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower on-resistance and higher efficiency, making them ideal for high-performance RF applications.

Configuration: SINGLE

The single configuration simplifies circuit design and allows for easy integration into existing systems.

Minimum DS Breakdown Voltage: 125 V

A higher breakdown voltage enhances reliability and allows the FET to handle substantial voltage variations in the application.

Package Shape: ROUND

The round package shape aids in effective thermal dissipation, which is crucial for maintaining performance in high-frequency applications.

Terminal Form: FLAT

Flat terminals provide better mounting stability and ease of soldering, improving manufacturability and reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control of the transistor, leading to efficient switching and amplification processes.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

This FET's compatibility with ultra-high frequency applications makes it an excellent choice for advanced RF and communication systems.

Maximum Drain Current (Abs)(ID): 20 A

A maximum drain current of 20 A provides ample power handling capability, making it suitable for high-performance applications.

No. of Terminals: 4

Having 4 terminals allows for greater circuit design flexibility and connectivity options.

Maximum Power Dissipation (Abs): 292 W

With a high power dissipation capability, this FET can handle intensive workloads without overheating, ensuring long-term reliability.

Package Style (Meter): FLANGE MOUNT

Flange mount design facilitates easy installation and enhances thermal management by providing a stable mounting structure.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high input impedance and low power consumption, making this FET efficient for a variety of applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows the FET to function effectively in harsh environments, enhancing its versatility.

Transistor Element Material: SILICON

Silicon as the element material offers excellent thermal stability and performance in RF applications, making it a popular choice.

Terminal Finish: TIN LEAD

A tin-lead finish provides good solderability and corrosion resistance, ensuring reliability in electrical connections.

Maximum Drain Current (ID): 20 A

Repeated mention of maximum drain current emphasizes its capability to manage substantial loads without performance degradation.

Terminal Position: RADIAL

Radial terminal positioning allows for efficient space utilization in PCB design, enhancing compactness in circuit layouts.

Technical Specifications

RF Power Field Effect Transistors (FET) SD2931 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Configuration:

Minimum DS Breakdown Voltage:

125 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

20 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

O-PRFM-F4

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

FLAT

Terminal Position:

RADIAL

Transistor Element Material:

SILICON

Trade Compliance

SD2931 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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