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SD57030

STMicroelectronics

SD57030 by STMicroelectronics

SD57030 by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 4 A, a breakdown voltage of 65 V, and operates in the ultra-high frequency band. This surface-mount transistor ensures efficient performance with a max temp of 200 °C.

Median Price

$55.450

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 50 parts In-Stock

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50

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Distributors (In-Stock)

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Vyrian

USA . 4,002 parts In-Stock

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4,002

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Digiode

USA . 2,770 parts In-Stock

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2,770

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Anansix

USA . 690 parts In-Stock

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690

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TME

Poland . 50 parts In-Stock

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$55.450

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50

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$55.450

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,339 parts In-Stock

1+ parts

$0.573

100+ parts

-

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$0.516

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-

1,339

$0.573

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$0.516

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MKK Technologies

India . 1,496 parts In-Stock

1+ parts

$1.078

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1,496

$1.078

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DigiPath Technology Company

USA . 1,496 parts In-Stock

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$1.078

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1,496

$1.078

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Component Stockers USA

USA . 6,138 parts In-Stock

1+ parts

$6.300

100+ parts

$5.990

1k+ parts

$5.790

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-

6,138

$6.300

$5.990

$5.790

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AZTECH Wire

Italy . 1,207 parts In-Stock

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$20.640

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1,207

$20.640

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Microchip USA

USA . 7,046 parts In-Stock

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7,046

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Corphita

USA . 3,029 parts In-Stock

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3,029

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Parana Technologies

USA . 1,833 parts In-Stock

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$0.685

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1,833

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$0.685

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Perfect Parts

USA . 276 parts In-Stock

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276

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Overview

Experience unparalleled performance with the SD57030 by STMicroelectronics, a leader in innovative semiconductor solutions. Designed for ultra-high frequency applications, this N-channel RF Power FET combines robust construction with exceptional efficiency, delivering reliable amplification for your projects. Trust in STMicroelectronics' reputation for quality and innovation to elevate your designs, ensuring maximum power dissipation and operational reliability when it matters most.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides durability and resistance to environmental factors, making the FET suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are typically used for their high efficiency and faster switching speeds, enhancing performance in amplifying applications.

Configuration: SINGLE

A single configuration simplifies circuit design and minimizes space requirements, making it ideal for compact applications.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET is capable of delivering high gain and high frequency performance in audio and RF applications.

Surface Mount: YES

Surface mount technology enables automated manufacturing processes, resulting in lower production costs and improved reliability.

Minimum DS Breakdown Voltage: 65 V

A higher breakdown voltage enhances the FET's ability to operate safely in high voltage applications, increasing its versatility.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space management on PCBs, making it suitable for high-density applications.

Terminal Form: FLAT

Flat terminals provide better surface contact during soldering, which improves thermal performance and reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption and improved switching characteristics, providing better efficiency.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Its capability to operate in the ultra-high frequency band makes it ideal for RF applications in communication and broadcasting.

Maximum Drain Current (Abs) (ID): 4 A

A maximum drain current of 4 A allows for higher performance in power amplification and signal handling.

No. of Terminals: 2

With only 2 terminals, this FET simplifies circuit integration, making it easy to implement in various designs.

Maximum Power Dissipation (Abs): 74 W

A high power dissipation capability ensures reliable operation under heavy loads, making this product useful for high-power applications.

Package Style (Meter): FLANGE MOUNT

Flange mounting provides robust mechanical stability and improves heat dissipation, ensuring reliable long-term operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology contributes to high efficiency, reduced power consumption, and improved performance in switching applications.

Maximum Operating Temperature: 200 °C

High thermal tolerance allows the FET to operate in extreme conditions, increasing its reliability in demanding environments.

Transistor Element Material: SILICON

Silicon material is widely used in FET manufacturing for its excellent electrical properties, contributing to overall device performance.

Maximum Drain Current (ID): 4 A

Reiterating the 4 A maximum drain current capacity showcases its ability to handle significant power, beneficial for various applications.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in design and enhances connectivity options in circuit layouts.

Case Connection: SOURCE

A source connection geometry helps maintain circuit integrity and optimizes performance in application environments.

Technical Specifications

RF Power Field Effect Transistors (FET) SD57030 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDFM-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

SD57030 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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