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SD57120

STMicroelectronics

SD57120 by STMicroelectronics

SD57120 by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 14 A, a breakdown voltage of 65 V, and operates in the ultra-high frequency band. This versatile component is ideal for high-power amplification in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,490 parts In-Stock

1+ parts

-

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7,490

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Digiode

USA . 3,803 parts In-Stock

1+ parts

-

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-

1k+ parts

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3,803

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Anansix

USA . 1,143 parts In-Stock

1+ parts

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1,143

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,807 parts In-Stock

1+ parts

$1.582

100+ parts

-

1k+ parts

$1.424

10k+ parts

-

1,807

$1.582

-

$1.424

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$2.048

100+ parts

$1.864

1k+ parts

$1.679

10k+ parts

-

2,500

$2.048

$1.864

$1.679

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MKK Technologies

India . 1,142 parts In-Stock

1+ parts

$2.976

100+ parts

-

1k+ parts

-

10k+ parts

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1,142

$2.976

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DigiPath Technology Company

USA . 1,142 parts In-Stock

1+ parts

$2.976

100+ parts

-

1k+ parts

-

10k+ parts

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1,142

$2.976

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AZTECH Wire

Italy . 79 parts In-Stock

1+ parts

$21.550

100+ parts

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79

$21.550

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Corphita

USA . 4,585 parts In-Stock

1+ parts

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4,585

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Parana Technologies

USA . 344 parts In-Stock

1+ parts

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100+ parts

$1.892

1k+ parts

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344

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$1.892

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Overview

Elevate your designs with the SD57120 from STMicroelectronics, a leader in innovation and quality. This N-channel RF power FET seamlessly combines robust performance with reliability, making it ideal for high-frequency amplifier applications. With superior power handling and thermal efficiency, this versatile component ensures optimal operation even under demanding conditions. Experience enhanced productivity and unmatched durability that only STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer better performance and efficiency in amplification applications, enhancing the overall effectiveness of the device.

Configuration: SINGLE

A single configuration allows for easier integration into circuits, simplifying design while reducing potential points of failure.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this transistor can effectively boost signal strength in communication systems.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly processes, leading to space-saving and efficient production.

Minimum DS Breakdown Voltage: 65 V

A minimum breakdown voltage of 65 V provides ample headroom for voltage swings in amplifier circuits, ensuring reliable operation under various conditions.

Package Shape: RECTANGULAR

The rectangular shape is advantageous for PCB layout designs, enabling efficient use of space on circuit boards.

Terminal Form: FLAT

Flat terminals facilitate better contact with the PCB, enhancing electrical performance and minimizing inductance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures that the transistor can be easily turned on and off, allowing for efficient signal modulation.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

This transistor's capability to operate in the ultra-high frequency band makes it suitable for high-speed applications, such as communication and radar.

Maximum Drain Current (Abs) (ID): 14 A

A high maximum drain current of 14 A supports robust performance in demanding applications, ensuring it can handle substantial loads.

No. of Terminals: 4

Four terminals provide versatility in circuit configurations, allowing for various connection options and improved layout flexibility.

Maximum Power Dissipation (Abs): 236 W

With a maximum power dissipation of 236 W, this FET can handle significant power levels, making it suitable for high-performance applications.

Package Style (Meter): FLANGE MOUNT

Flange mount packages offer robust mechanical stability, making them ideal for applications that require easily accessible replacement and maintenance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enhances performance in terms of switching speed and efficiency, making this FET a good choice for modern electronic designs.

Maximum Operating Temperature: 150 °C

The ability to operate at high temperatures up to 150 °C ensures reliability in demanding environments, enhancing the longevity of the device.

Transistor Element Material: SILICON

Silicon is a well-established material in semiconductor technology, offering excellent electrical properties and thermal stability.

Maximum Drain Current (ID): 14 A

Reiterating a robust max drain current allows for effective performance, particularly in power amplification and high-load scenarios.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility in circuit design, allowing easier integration with different layout configurations.

Case Connection: SOURCE

A direct source connection simplifies circuit design and improves signal integrity, making it suitable for various RF applications.

Technical Specifications

RF Power Field Effect Transistors (FET) SD57120 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

14 A

Maximum Drain Current (ID):

14 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDFM-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

SD57120 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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