Loading...

PD54003

STMicroelectronics

PD54003 by STMicroelectronics

STMicroelectronics PD54003 is an N-CHANNEL RF Power FET with 25V DS Breakdown Voltage. It operates in the Ultra High Frequency Band, with 4A Drain Current and 52.8W Power Dissipation. Ideal for amplifier applications, it features a Gull Wing terminal form and small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,475 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,475

-

-

-

-

Anansix

USA . 1,585 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,585

-

-

-

-

Digiode

USA . 1,395 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,395

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,722 parts In-Stock

1+ parts

$1.485

100+ parts

-

1k+ parts

$1.336

10k+ parts

-

1,722

$1.485

-

$1.336

-

MKK Technologies

India . 2,247 parts In-Stock

1+ parts

$2.792

100+ parts

-

1k+ parts

-

10k+ parts

-

2,247

$2.792

-

-

-

DigiPath Technology Company

USA . 2,247 parts In-Stock

1+ parts

$2.792

100+ parts

-

1k+ parts

-

10k+ parts

-

2,247

$2.792

-

-

-

Parana Technologies

USA . 1,130 parts In-Stock

1+ parts

-

100+ parts

$1.775

1k+ parts

-

10k+ parts

-

1,130

-

$1.775

-

-

Corphita

USA . 206 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

206

-

-

-

-

Overview

Experience high-quality performance with the PD54003 RF Power FET from STMicroelectronics. As a leader in semiconductor technology, STMicroelectronics delivers top-notch products that exceed industry standards. This N-CHANNEL transistor, designed for amplifier applications in the ultra-high frequency band, offers customers unmatched value and benefits. With a maximum power dissipation of 52.8 W and a minimum DS breakdown voltage of 25 V, the PD54003 is the perfect choice for your RF power needs. Trust STMicroelectronics to provide you with cutting-edge solutions for all your RF power requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good mechanical protection, making the transistor durable and reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher mobility and conductivity, resulting in better overall performance.

Configuration: SINGLE

Single configuration simplifies circuit design and makes integration easier.

Transistor Application: AMPLIFIER

Designed specifically for amplification applications, ensuring high-quality signal processing.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Minimum DS Breakdown Voltage: 25 V

High breakdown voltage ensures reliability and protection against voltage spikes.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on circuit boards.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and are easy to solder onto circuit boards.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control and efficiency in amplification applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra-high frequency applications, offering excellent performance in high-frequency circuits.

Maximum Drain Current (Abs) (ID): 4 A

High maximum drain current allows for handling higher power applications.

No. of Terminals: 2

Two terminals provide a simple and straightforward connection in circuit designs.

Maximum Power Dissipation (Abs): 52.8 W

High power dissipation capability ensures the transistor can handle high-power applications without overheating.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on circuit boards and allows for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and efficiency in signal processing.

Maximum Operating Temperature: 165 °C

High maximum operating temperature ensures the transistor can operate in a wide range of temperature conditions.

Transistor Element Material: SILICON

Silicon material offers good electrical properties and reliability in transistor performance.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and ensures secure connections in circuit designs.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit integration and design.

Case Connection: SOURCE

Source connection allows for easy integration into amplifier circuits, providing efficient signal amplification.

Technical Specifications

RF Power Field Effect Transistors (FET) PD54003 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD54003 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 18