Loading...

PD54003S-E

STMicroelectronics

PD54003S-E by STMicroelectronics

PD54003S-E by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 4 A, a breakdown voltage of 25 V, and operates in the ultra-high frequency band. This compact surface-mount device ensures efficient performance up to 165 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,327 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,327

-

-

-

-

Anansix

USA . 1,902 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,902

-

-

-

-

Digiode

USA . 510 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

510

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,436 parts In-Stock

1+ parts

$0.304

100+ parts

-

1k+ parts

$0.273

10k+ parts

-

1,436

$0.304

-

$0.273

-

MKK Technologies

India . 1,766 parts In-Stock

1+ parts

$0.571

100+ parts

-

1k+ parts

-

10k+ parts

-

1,766

$0.571

-

-

-

DigiPath Technology Company

USA . 1,766 parts In-Stock

1+ parts

$0.571

100+ parts

-

1k+ parts

-

10k+ parts

-

1,766

$0.571

-

-

-

AZTECH Wire

Italy . 35 parts In-Stock

1+ parts

$17.250

100+ parts

-

1k+ parts

-

10k+ parts

-

35

$17.250

-

-

-

Corphita

USA . 1,937 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,937

-

-

-

-

Parana Technologies

USA . 481 parts In-Stock

1+ parts

-

100+ parts

$0.363

1k+ parts

-

10k+ parts

-

481

-

$0.363

-

-

Overview

Unlock superior performance with the PD54003S-E from STMicroelectronics! As a leader in innovation, STMicroelectronics delivers unmatched quality and reliability in RF Power FETs. This high-performance N-channel amplifier excels in ultra-high frequency applications, making it perfect for advanced communication systems. Experience enhanced efficiency and robust power handling—ideal for driving your next groundbreaking project forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good durability and thermal stability, making the product suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher efficiency and better performance for amplification applications.

Configuration: SINGLE

A single configuration simplifies circuit design and layout, making integration easier in compact devices.

Transistor Application: AMPLIFIER

Designed for amplification, this transistor offers high performance for audio, RF, and other signal processing tasks.

Surface Mount: YES

Surface mount technology allows for smaller circuit boards and efficient manufacturing processes.

Minimum DS Breakdown Voltage: 25 V

A minimum breakdown voltage of 25 V ensures reliable operation in various applications without early failure.

Package Shape: RECTANGULAR

Rectangular packaging allows for efficient space utilization on printed circuit boards.

Terminal Form: FLAT

Flat terminals enhance soldering performance and promote optimal electrical connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode provides better control and efficiency, making it ideal for high-frequency applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Compatibility with ultra high frequency bands makes it suitable for advanced communication systems and applications.

Maximum Drain Current (Abs) (ID): 4 A

A maximum drain current of 4 A supports robust power handling, suitable for demanding applications.

No. of Terminals: 2

Fewer terminals simplify connections and reduce potential points of failure in the circuit.

Maximum Power Dissipation (Abs): 52.8 W

High power dissipation capability allows for greater thermal management, enabling reliable operation under load.

Package Style (Meter): SMALL OUTLINE

Small outline package style is space-efficient, making it suitable for modern compact electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enhances switching speed and control, ensuring excellent performance in various applications.

Maximum Operating Temperature: 165 °C

A high operating temperature range ensures that the product can function efficiently in extreme environments.

Transistor Element Material: SILICON

Silicon is a standard yet effective material for FETs, providing reliability and optimal performance.

Maximum Drain Current (ID): 4 A

Repeat of ID specification reinforces the high current handling capability, crucial for robust applications.

Terminal Position: DUAL

Dual terminal positions facilitate easier integration and flexibility in circuit layout.

Case Connection: SOURCE

Direct source connection improves performance and simplifies the design process in amplifier circuits.

Technical Specifications

RF Power Field Effect Transistors (FET) PD54003S-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD54003S-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 18