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PD54003L

STMicroelectronics

PD54003L by STMicroelectronics

PD54003L by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 4 A, a breakdown voltage of 25 V, and operates in the ultra-high frequency band. This surface-mount transistor ensures efficient performance with a max temp of 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,164 parts In-Stock

1+ parts

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3,164

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Anansix

USA . 1,977 parts In-Stock

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1,977

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Vyrian

USA . 1,977 parts In-Stock

1+ parts

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1,977

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,144 parts In-Stock

1+ parts

$1.212

100+ parts

-

1k+ parts

$1.090

10k+ parts

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1,144

$1.212

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$1.090

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MKK Technologies

India . 1,122 parts In-Stock

1+ parts

$2.278

100+ parts

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1,122

$2.278

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DigiPath Technology Company

USA . 1,122 parts In-Stock

1+ parts

$2.278

100+ parts

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1,122

$2.278

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Corphita

USA . 3,141 parts In-Stock

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3,141

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Parana Technologies

USA . 148 parts In-Stock

1+ parts

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100+ parts

$1.449

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148

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$1.449

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Overview

Unlock the power of innovation with the PD54003L from STMicroelectronics, a leader in cutting-edge semiconductor technology. This N-channel RF Power FET delivers exceptional amplification performance for ultra-high frequency applications, ensuring reliability and efficiency. With its compact design and robust capabilities, it empowers engineers to create advanced solutions in telecommunications and broadcast systems, enhancing signal quality and operational excellence. Elevate your projects with ST's commitment to quality and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer better performance in amplification applications, allowing for higher efficiency.

Configuration: SINGLE

A single configuration simplifies circuit design, making it easier to integrate into various electronic systems.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET is ideal for audio, RF, and other signal processing applications.

Surface Mount: YES

Surface mount technology enables compact PCB designs and improves overall assembly efficiency.

Minimum DS Breakdown Voltage: 25 V

A minimum breakdown voltage of 25V ensures the transistor can handle a variety of operational conditions safely.

Package Shape: SQUARE

The square package shape aids in uniform heat distribution, enhancing thermal management in applications.

Terminal Form: NO LEAD

No lead terminal design allows for a compact footprint and minimizes potential interference in high-frequency circuits.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for high efficiency and ideal turn-on characteristics for switching applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capable of operating in the ultra high frequency band makes this FET suitable for high-speed communications applications.

Maximum Drain Current (Abs) (ID): 4 A

A maximum drain current of 4A provides ample current handling capabilities for demanding applications.

No. of Terminals: 5

Five terminals allow for versatile connections, enabling flexibility in circuit design and integration.

Maximum Power Dissipation (Abs): 44 W

With a power dissipation of 44W, this FET can handle substantial power loads while remaining reliable.

Package Style (Meter): CHIP CARRIER

The chip carrier package style allows for efficient thermal management and compatibility with various mounting methods.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, enhancing performance in many applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C ensures reliable performance even in high-temperature environments.

Transistor Element Material: SILICON

Silicon as a material offers excellent electrical properties and is widely used, ensuring availability and reliability.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and reliability in connections, enhancing overall product performance.

Maximum Drain Current (ID): 4 A

Reiterating the 4A maximum drain current ensures this specification is emphasized for customers needing robust performance.

Terminal Position: QUAD

The quad terminal position supports advanced circuit configurations, making it suitable for complex designs.

Case Connection: SOURCE

Source connection aids in effective integration into circuits, ensuring optimal performance in various applications.

Technical Specifications

RF Power Field Effect Transistors (FET) PD54003L attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

S-PQCC-N5

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD54003L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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