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PTFA080551FV4R250XTMA1

Infineon Technologies

PTFA080551FV4R250XTMA1 by Infineon Technologies

Infineon's PTFA080551FV4R250XTMA1 is an N-CHANNEL RF Power FET with 65V DS Breakdown Voltage and 18dB Power Gain. Ideal for AMPLIFIER applications in ULTRA HIGH FREQUENCY BAND, it features a CERAMIC/METAL-SEALED COFIRED package and operates in ENHANCEMENT MODE at up to 200°C.

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3

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1k+

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Digiode

USA . 541 parts In-Stock

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Vyrian

USA . 411 parts In-Stock

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411

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Nova Conductors

Japan . 300 parts In-Stock

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Modulus Dynamics

Lithuania . 15,594 parts In-Stock

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$0.769

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$0.738

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$0.707

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15,594

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Corohmni

South Africa . 152 parts In-Stock

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$1.772

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Aztec Data Supply Inc.

USA . 2,215 parts In-Stock

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$1.800

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AZTECH Wire

Italy . 829 parts In-Stock

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Continental Prestige Electronics

USA . 6,750 parts In-Stock

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Corphita

USA . 518 parts In-Stock

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Argo Parts USA

USA . 398 parts In-Stock

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398

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Bastille Electronics

Australia . 36 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the PTFA080551FV4R250XTMA1 by Infineon Technologies. This RF Power Field Effect Transistor offers unparalleled quality and reliability, making it the top choice for amplifier applications in the ultra-high frequency band. With a minimum DS breakdown voltage of 65V and a power gain of 18dB, this transistor delivers exceptional performance. Experience the benefits of enhanced mode operation and surface mount capability, providing you with seamless integration and superior functionality. Elevate your projects with the PTFA080551FV4R250XTMA1 and unlock limitless possibilities.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This durable package material ensures long-term reliability and protection for the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher mobility and conductivity, making them ideal for high-frequency applications.

Configuration: SINGLE

Single configuration transistors are simpler to design with and can offer better performance in certain applications.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this transistor is optimized for audio and RF signal processing.

Surface Mount: YES

Surface mount packaging allows for easy integration onto circuit boards, saving space and reducing assembly costs.

Minimum DS Breakdown Voltage: 65 V

With a high breakdown voltage, this transistor can handle higher input power levels without damage.

Minimum Power Gain (Gp): 18 dB

A high power gain indicates that this transistor can amplify signals efficiently, leading to better overall performance.

Package Shape: SQUARE

The square shape of the package makes it easier to mount and provides better thermal management.

Terminal Form: FLAT

Flat terminals offer a stable connection and make soldering easier during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control over the amplification process, allowing for precise signal processing.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operating in the ultra-high frequency band, this transistor is suitable for advanced communication systems and radar applications.

No. of Terminals: 2

With only 2 terminals, this transistor is easy to integrate into circuit designs and reduces complexity.

Package Style (Meter): FLATPACK

The flatpack style offers a compact design, making it ideal for applications where space is limited.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency and low power consumption, making this transistor energy-efficient.

Maximum Operating Temperature: 200 °C

With a high operating temperature, this transistor can withstand harsh conditions and provide reliable performance.

Transistor Element Material: SILICON

Silicon transistors offer high performance and stability, making them a popular choice for RF applications.

Terminal Position: DUAL

Dual terminal positioning allows for easy connections and ensures proper alignment during installation.

Case Connection: SOURCE

The source-connected case provides a common ground reference, simplifying circuit design and ensuring stable operation.

Technical Specifications

RF Power Field Effect Transistors (FET) PTFA080551FV4R250XTMA1 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

S-CDFP-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

SQUARE

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Minimum Power Gain (Gp):

18 dB

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PTFA080551FV4R250XTMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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