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MRF181SR1

Onsemi

MRF181SR1 by Onsemi

MRF181SR1 by Onsemi is an N-CHANNEL RF Power FET with 65V DS Breakdown Voltage. It operates in the ULTRA HIGH FREQUENCY BAND, ideal for AMPLIFIER applications. This SINGLE configuration FET has a max ID of 2A and comes in a CERAMIC, METAL-SEALED COFIRED package.

Median Price

$22.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,073 parts In-Stock

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$22.000

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Digiode

USA . 1,546 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 928 parts In-Stock

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928

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Bristol Electronics

USA . 928 parts In-Stock

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Dan-Mar Components

USA . 928 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,175 parts In-Stock

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$47.050

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Kulean Microsystems

USA . 7,777 parts In-Stock

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Problanco Electronics

Mexico . 3,907 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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TANS Electronics

Latvia . 2,270 parts In-Stock

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SupplyDigital Components

Austria . 2,081 parts In-Stock

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Corphita

USA . 2,073 parts In-Stock

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UHIMA Technologies

Türkiye . 570 parts In-Stock

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Corohmni

South Africa . 255 parts In-Stock

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Perfect Parts

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USA . 2 parts In-Stock

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Overview

Experience the superior performance of the MRF181SR1 RF Power FET from Onsemi. With a focus on quality and innovation, Onsemi delivers cutting-edge solutions for amplifier applications in the ultra-high frequency band. The ceramic, metal-sealed co-fired package ensures reliability and durability, while the N-channel configuration offers enhanced efficiency. Transform your RF power amplification with this single-channel transistor that provides exceptional value and benefits to customers across various industries. Trust Onsemi for unmatched quality and performance in RF power field effect transistors.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired body material ensures durability and reliability in harsh operating conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel type provides high electron mobility and better performance compared to P-Channel type in this application.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimized performance in signal processing.

Minimum DS Breakdown Voltage: 65 V

The high breakdown voltage of 65V ensures reliable operation and protection against voltage spikes.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort.

Maximum Drain Current (ID): 2 A

With a maximum drain current of 2A, this transistor can handle high power levels, making it suitable for demanding applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high speed and low power consumption, ideal for applications requiring efficiency.

Transistor Element Material: SILICON

Silicon-based transistors provide high performance and reliability, making them a popular choice in electronic devices.

Technical Specifications

RF Power Field Effect Transistors (FET) MRF181SR1 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (ID):

2 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-CDFP-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLATPACK

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MRF181SR1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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