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PD84008TR-E

STMicroelectronics

PD84008TR-E by STMicroelectronics

PD84008TR-E by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 7 A, a breakdown voltage of 25 V, and operates in the ultra-high frequency band. This surface-mount transistor ensures efficient performance with a max power dissipation of 79 W.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,438 parts In-Stock

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4,438

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Digiode

USA . 4,151 parts In-Stock

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4,151

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Anansix

USA . 212 parts In-Stock

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212

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,283 parts In-Stock

1+ parts

$1.664

100+ parts

-

1k+ parts

$1.498

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2,283

$1.664

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$1.498

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MKK Technologies

India . 1,497 parts In-Stock

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$3.130

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1,497

$3.130

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DigiPath Technology Company

USA . 1,497 parts In-Stock

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$3.130

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1,497

$3.130

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Corphita

USA . 2,370 parts In-Stock

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2,370

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Parana Technologies

USA . 1,812 parts In-Stock

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$1.990

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1,812

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$1.990

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Overview

Unlock powerful performance with the PD84008TR-E by STMicroelectronics, a premier N-channel RF Power FET designed for superior amplification in ultra-high-frequency applications. Renowned for quality and innovation, STMicroelectronics ensures reliability and efficiency, making this compact solution ideal for modern communication systems. Experience exceptional power dissipation and thermal management while elevating your designs to new heights of excellence and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy package provides excellent protection against environmental factors, ensuring reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel transistors offer higher efficiency and better performance in amplification applications.

Configuration: SINGLE

A single configuration simplifies circuit design and assembly for various applications.

Transistor Application: AMPLIFIER

Specifically designed for amplification, this FET is ideal for audio and RF signal applications.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly, making it suitable for modern electronics.

Minimum DS Breakdown Voltage: 25 V

A breakdown voltage of 25V enables use in a range of moderate voltage applications, enhancing versatility.

Package Shape: RECTANGULAR

The rectangular package shape is optimal for efficient PCB layout and space-saving designs.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering and mechanical strength, ensuring reliable connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption and efficient amplification in active circuits.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Compatible with ultra-high frequency applications, making it suitable for advanced communication systems.

Maximum Drain Current (Abs) (ID): 7 A

The ability to handle up to 7A of continuous current makes this FET suitable for high-power applications.

No. of Terminals: 2

A simple 2-terminal design reduces complexity while ensuring effective functionality.

Maximum Power Dissipation (Abs): 79 W

79W max power dissipation ensures this transistor can handle demanding applications without overheating.

Package Style (Meter): SMALL OUTLINE

Small outline design allows for high-density circuit layouts, optimizing space utilization in designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology is known for high input impedance and low power loss, making it very efficient.

Maximum Operating Temperature: 165 °C

Operating up to 165 °C ensures reliability in high-temperature environments, suitable for rugged applications.

Transistor Element Material: SILICON

Silicon offers excellent thermal characteristics and performance in a wide range of applications.

Maximum Drain Current (ID): 7 A

The FET's capability to manage 7A of drain current ensures it can effectively drive loads in power applications.

Terminal Position: DUAL

Dual terminal positioning can provide easier connections and integration into circuits.

Case Connection: SOURCE

Source connection configuration improves circuit layout flexibility and enhances overall performance.

Technical Specifications

RF Power Field Effect Transistors (FET) PD84008TR-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD84008TR-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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