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PD84010STR-E

STMicroelectronics

PD84010STR-E by STMicroelectronics

PD84010STR-E by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 8 A, a breakdown voltage of 40 V, and operates in the ultra-high frequency band. This compact surface-mount transistor ensures efficient performance with a max power dissipation of 95 W.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,746 parts In-Stock

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1,746

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Vyrian

USA . 1,474 parts In-Stock

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1,474

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Digiode

USA . 1,196 parts In-Stock

1+ parts

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1,196

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,544 parts In-Stock

1+ parts

$1.825

100+ parts

-

1k+ parts

$1.643

10k+ parts

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1,544

$1.825

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$1.643

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MKK Technologies

India . 309 parts In-Stock

1+ parts

$3.432

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309

$3.432

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DigiPath Technology Company

USA . 309 parts In-Stock

1+ parts

$3.432

100+ parts

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309

$3.432

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Corphita

USA . 2,586 parts In-Stock

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2,586

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Parana Technologies

USA . 1,314 parts In-Stock

1+ parts

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$2.182

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1,314

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$2.182

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Overview

Elevate your designs with the PD84010STR-E from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel RF Power FET excels in amplification applications, delivering reliability and outstanding performance even in demanding environments. With its compact surface mount design and impressive power handling capabilities, it’s perfect for ultra-high frequency projects. Trust STMicroelectronics for quality that enhances your projects and drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection of the FET in various operating environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer higher electron mobility, leading to enhanced efficiency in amplifier applications.

Configuration: SINGLE

A single configuration allows for simplified circuit design, making it easier to integrate into various systems.

Transistor Application: AMPLIFIER

Optimized for amplification, this FET is ideal for applications requiring signal boosting.

Surface Mount: YES

Surface mount technology facilitates compact PCB designs, maximizing space efficiency in electronic devices.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40V, it can handle robust electrical conditions, ensuring longevity and reliability.

Package Shape: RECTANGULAR

The rectangular shape allows for easy positioning on PCBs, enhancing manufacturability and alignment.

Terminal Form: FLAT

Flat terminals ensure secure connections with minimal contact resistance, improving overall performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation leads to lower gate threshold voltages, resulting in energy-efficient performance.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra high frequency applications, making it suitable for advanced communication systems.

Maximum Drain Current (Abs) (ID): 8 A

A maximum drain current of 8A allows for significant power handling, making it suitable for high-demand applications.

No. of Terminals: 2

With only two terminals, this FET simplifies connection and reduces potential points of failure in a circuit.

Maximum Power Dissipation (Abs): 95 W

High power dissipation capability (95W) enables effective heat management, crucial for reliable performance.

Package Style (Meter): SMALL OUTLINE

The small outline package style further enhances design flexibility in space-constrained environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for higher input impedance and better switching performance compared to other types.

Maximum Operating Temperature: 165 °C

Capable of operating at high temperatures (165 °C) ensures reliability in demanding environments.

Transistor Element Material: SILICON

Silicon provides excellent thermal stability and performance, essential for consistent operation.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability, improving manufacturing efficiency and assembly reliability.

Maximum Drain Current (ID): 8 A

Reiterating the capability for 8A drain current, this feature reinforces its suitability for high-performance applications.

Terminal Position: DUAL

Dual terminal positioning enhances connection options, facilitating versatility in circuit designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, which requires sensible handling but is manageable in standard conditions.

Case Connection: SOURCE

Source connection ensures appropriate grounding and stable performance of the FET within applications.

Technical Specifications

RF Power Field Effect Transistors (FET) PD84010STR-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

8 A

Maximum Drain Current (ID):

8 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD84010STR-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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