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PD84010S-E

STMicroelectronics

PD84010S-E by STMicroelectronics

PD84010S-E by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 8 A, a breakdown voltage of 40 V, and operates in the ultra-high frequency band. This compact surface-mount transistor ensures efficient performance up to 165 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,422 parts In-Stock

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6,422

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Digiode

USA . 4,485 parts In-Stock

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4,485

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Anansix

USA . 135 parts In-Stock

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135

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,327 parts In-Stock

1+ parts

$1.029

100+ parts

-

1k+ parts

$0.926

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2,327

$1.029

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$0.926

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MKK Technologies

India . 1,757 parts In-Stock

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$1.934

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1,757

$1.934

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DigiPath Technology Company

USA . 1,757 parts In-Stock

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$1.934

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1,757

$1.934

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AZTECH Wire

Italy . 1,125 parts In-Stock

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$19.920

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1,125

$19.920

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Corphita

USA . 4,985 parts In-Stock

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4,985

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Parana Technologies

USA . 807 parts In-Stock

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$1.230

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807

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$1.230

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Overview

Unlock exceptional performance with the PD84010S-E from STMicroelectronics, a leader in cutting-edge semiconductor solutions. Designed for ultra-high frequency applications, this N-channel RF Power FET not only delivers unparalleled efficiency and power handling but also ensures reliability you can trust. Perfect for amplifiers, it offers superior thermal management and compact design, empowering your innovations while maximizing product lifespan and performance. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making the FET suitable for a wide range of environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer higher electron mobility, leading to better performance in amplifier applications.

Configuration: SINGLE

A single configuration simplifies design and integration into circuits, making it easy to use in various applications.

Transistor Application: AMPLIFIER

Designed for amplification, this FET is ideal for use in audio and RF applications, enhancing signal strength effectively.

Surface Mount: YES

Surface mount technology allows for smaller PCB designs and higher component density, resulting in space savings and improved performance.

Minimum DS Breakdown Voltage: 40 V

A minimum breakdown voltage of 40 V allows for stable operation in higher voltage applications, enhancing reliability.

Package Shape: RECTANGULAR

The rectangular shape makes it suitable for various mounting applications and optimizes space on circuit boards.

Terminal Form: FLAT

Flat terminals provide excellent contact and thermal management, ensuring efficient operation and reduced heat buildup.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for greater control of the output current, contributing to improved efficiency and performance.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capable of operating in the ultra high frequency range, this FET is ideal for high-frequency applications such as RF amplifiers.

Maximum Drain Current (Abs) (ID): 8 A

With a maximum drain current of 8 A, this FET can handle substantial loads, making it versatile for various applications.

No. of Terminals: 2

A simple two-terminal design enhances ease of integration into various circuits and reduces layout complexity.

Maximum Power Dissipation (Abs): 95 W

This high power dissipation capability ensures that the FET can operate efficiently under demanding conditions without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes space consumption, making it suitable for compact electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, making this FET suitable for high-performance applications.

Maximum Operating Temperature: 165 °C

A maximum operating temperature of 165 °C allows for operation in demanding environments, enhancing reliability in various applications.

Transistor Element Material: SILICON

Silicon is the predominant material used in semiconductors, providing excellent performance characteristics and cost-effectiveness.

Terminal Finish: MATTE TIN

Matte tin finishes provide good solderability and corrosion resistance, ensuring durable connections over the lifetime of the product.

Maximum Drain Current (ID): 8 A

This maximum drain current capability allows the device to support heavy-load applications, increasing its versatility.

Terminal Position: DUAL

Dual terminal positioning aids in easy connections and integrative layout design, making it user-friendly.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, guiding proper handling and storage practices to ensure reliability.

Case Connection: SOURCE

The source connection in the case design enhances thermal management, ensuring efficient operation under high load conditions.

Technical Specifications

RF Power Field Effect Transistors (FET) PD84010S-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

8 A

Maximum Drain Current (ID):

8 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD84010S-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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