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PD55003-01

STMicroelectronics

PD55003-01 by STMicroelectronics

PD55003-01 by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a 40V min breakdown voltage, operates at ultra-high frequencies, and supports a max drain current of 2.5A. Ideal for compact surface mount designs, it excels in high-temperature environments up to 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,671 parts In-Stock

1+ parts

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2,671

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Digiode

USA . 1,433 parts In-Stock

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1,433

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Vyrian

USA . 912 parts In-Stock

1+ parts

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912

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 988 parts In-Stock

1+ parts

$0.900

100+ parts

-

1k+ parts

$0.810

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988

$0.900

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$0.810

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MKK Technologies

India . 783 parts In-Stock

1+ parts

$1.692

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-

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783

$1.692

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DigiPath Technology Company

USA . 783 parts In-Stock

1+ parts

$1.692

100+ parts

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783

$1.692

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Corphita

USA . 2,461 parts In-Stock

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2,461

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Parana Technologies

USA . 356 parts In-Stock

1+ parts

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100+ parts

$1.076

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356

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$1.076

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Overview

Elevate your projects with the PD55003-01 from STMicroelectronics, a leading name in electronic innovation. This high-performance RF Power FET excels in amplifier applications, delivering superior efficiency and reliability even in ultra-high frequency scenarios. Its robust design ensures exceptional thermal management, making it perfect for demanding environments. Experience unparalleled quality and performance that sets your designs apart, backed by ST's commitment to excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides excellent mechanical stability and protection against environmental factors, making the transistor durable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer higher electron mobility, resulting in better performance and efficiency in amplification applications.

Configuration: SINGLE

A single configuration simplifies the design process and minimizes the footprint on the circuit board, making it easy to integrate into various applications.

Transistor Application: AMPLIFIER

Designed for amplification, this transistor improves signal strength, making it ideal for RF communication systems.

Surface Mount: YES

Surface mount technology allows for compact designs and easier automation in manufacturing, reducing overall costs.

Minimum DS Breakdown Voltage: 40 V

A breakdown voltage of 40 V ensures reliable operation in high-voltage environments, providing robustness in various applications.

Package Shape: SQUARE

The square shape enables efficient use of PCB space and optimal thermal management, improving reliability.

Terminal Form: NO LEAD

No-lead designs facilitate direct soldering to the PCB, enhancing performance reliability while reducing manufacturing complexity.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for high efficiency and better control of current flow, making it suitable for modern RF circuits.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operating in the ultra-high frequency band ensures the transistor is suitable for advanced communication technologies and applications.

Maximum Drain Current (Abs) (ID): 2.5 A

A maximum drain current of 2.5 A delivers strong performance in demanding applications, capable of handling significant loads.

No. of Terminals: 12

Having 12 terminals allows for greater flexibility in circuit design, enabling more complex configurations and functionalities.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging provides excellent thermal characteristics and connectivity, enhancing the performance of the transistor.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and fast switching, making this FET suitable for high-frequency amplification and digital applications.

Maximum Operating Temperature: 150 °C

A high operating temperature threshold guarantees reliable performance in harsh environments, enhancing its applicability in diverse industries.

Transistor Element Material: SILICON

Silicon is a well-established material for transistors, known for its excellent electrical properties and reliability in various applications.

Maximum Drain Current (ID): 2.5 A

Repeated for emphasis: this maximum drain current capability ensures the transistor can handle significant current loads efficiently.

Terminal Position: QUAD

Quad terminal positioning allows for versatile circuit designs, simplifying interconnections and layout configuration.

Case Connection: SOURCE

Direct source connection improves thermal management and simplifies the integration process in PCB designs, boosting overall circuit efficiency.

Technical Specifications

RF Power Field Effect Transistors (FET) PD55003-01 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

2.5 A

Maximum Drain Current (ID):

2.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

S-PQCC-N12

No. of Elements:

1

No. of Terminals:

12

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD55003-01 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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