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A3T18H408W24SR3

NXP Semiconductors

A3T18H408W24SR3 by NXP Semiconductors

N-CHANNEL; Configuration: COMPLEX; Surface Mount: YES; Package Shape: RECTANGULAR; Operating Mode: ENHANCEMENT MODE; Package Body Material: CERAMIC, METAL-SEALED COFIRED;

Median Price

$74.990

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 14,750 parts In-Stock

1+ parts

-

100+ parts

$14.670

1k+ parts

$14.670

10k+ parts

$14.670

14,750

-

$14.670

$14.670

$14.670

Flip Electronics (Authorized)

USA . 14,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,750

-

-

-

-

Verical

USA . 14,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$84.196

10k+ parts

-

14,700

-

-

$84.196

-

Rochester

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$74.990

1k+ parts

$67.100

10k+ parts

$63.150

200

-

$74.990

$67.100

$63.150

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,719 parts In-Stock

1+ parts

$14.670

100+ parts

-

1k+ parts

-

10k+ parts

-

1,719

$14.670

-

-

-

Digiode

USA . 4,380 parts In-Stock

1+ parts

$79.344

100+ parts

-

1k+ parts

-

10k+ parts

-

4,380

$79.344

-

-

-

Flip Electronics

USA . 14,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,750

-

-

-

-

Anansix

USA . 2,587 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,587

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 502 parts In-Stock

1+ parts

$0.353

100+ parts

-

1k+ parts

-

10k+ parts

$0.339

502

$0.353

-

-

$0.339

Northwest PG Solutions

USA . 1,564 parts In-Stock

1+ parts

$0.388

100+ parts

-

1k+ parts

-

10k+ parts

$0.342

1,564

$0.388

-

-

$0.342

Corphita

USA . 2,079 parts In-Stock

1+ parts

$75.168

100+ parts

-

1k+ parts

-

10k+ parts

-

2,079

$75.168

-

-

-

Microchip USA

USA . 9,810 parts In-Stock

1+ parts

$172.500

100+ parts

-

1k+ parts

-

10k+ parts

-

9,810

$172.500

-

-

-

UNI Independent Distributors

Spain . 2,758 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,758

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Technical Specifications

RF Power Field Effect Transistors (FET) A3T18H408W24SR3 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Minimum DS Breakdown Voltage:

65 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

L BAND

JESD-30 Code:

R-CQFP-F6

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

225 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Minimum Power Gain (Gp):

14.3 dB

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

A3T18H408W24SR3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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