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PD55025S

STMicroelectronics

PD55025S by STMicroelectronics

PD55025S by STMicroelectronics is an N-CHANNEL RF Power Field Effect Transistor (FET) with a min DS breakdown voltage of 40V. It is used as an amplifier in the ultra high frequency band, with a max drain current of 7A and a max power dissipation of 79W.

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< 1k

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Digiode

USA . 592 parts In-Stock

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Anansix

USA . 193 parts In-Stock

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Vyrian

USA . 130 parts In-Stock

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Nova Conductors

Japan . 17 parts In-Stock

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IDEA Electronic Components Group

UK . 1,519 parts In-Stock

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$1.179

100+ parts

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$1.061

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1,519

$1.179

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$1.061

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MKK Technologies

India . 946 parts In-Stock

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$2.218

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$2.218

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DigiPath Technology Company

USA . 946 parts In-Stock

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$2.218

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946

$2.218

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AZTECH Wire

Italy . 705 parts In-Stock

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$10.126

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705

$10.126

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Ampacity Inc.

Singapore . 524 parts In-Stock

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$26.050

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524

$26.050

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Semicontronic

India . 734 parts In-Stock

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$65.050

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$63.424

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$63.098

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734

$65.050

$63.424

$63.098

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Continental Prestige Electronics

USA . 5,614 parts In-Stock

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Corphita

USA . 649 parts In-Stock

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Parana Technologies

USA . 395 parts In-Stock

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$1.410

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$1.410

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Argo Parts USA

USA . 377 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Discover the power of the PD55025S by STMicroelectronics, a high-quality RF Power Field Effect Transistor (FET) that brings exceptional performance to your amplifier applications. With its advanced technology and innovative design, this transistor offers outstanding reliability and efficiency. The PD55025S is designed to deliver ultra-high frequency performance, making it perfect for even the most demanding applications. Its small outline package style ensures easy integration, while its N-channel configuration and enhancement mode operation provide unparalleled versatility. Experience the benefits of this groundbreaking product and unlock new possibilities in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides excellent durability and resistance against external factors, making this product suitable for various applications in RF power amplifiers.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration offers efficient and reliable amplification of RF signals, making this product an ideal choice for amplifier applications.

Configuration: SINGLE

The single configuration simplifies the circuitry and enhances the overall performance of the RF power FET, making it an excellent choice for amplifier designs requiring a single-channel operation.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this RF power FET delivers high performance amplification, ensuring optimum signal processing and increased efficiency.

Surface Mount: YES

With its surface mount capability, this RF power FET provides ease of installation and reduces assembly time, making it a convenient choice for compact and space-constrained electronic systems.

Minimum DS Breakdown Voltage: 40 V

The minimum DS (drain-source) breakdown voltage of 40 V allows for reliable operation in high-power applications, making this product suitable for demanding RF amplification tasks.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration into circuit designs and ensures efficient heat dissipation, enhancing the overall performance and reliability of the RF power FET.

Terminal Form: FLAT

The flat terminal form enables secure and reliable electrical connections, ensuring consistent performance and eliminating the potential for signal degradation.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operating mode allows for precise control and manipulation of the RF signal, resulting in improved signal amplification and enhanced overall system performance.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

With its capability to operate in the ultra-high frequency band, this RF power FET enables excellent signal amplification and processing for a wide range of high-frequency applications.

No. of Elements: 1

Featuring a single element, this RF power FET provides simplified circuit design and ease of integration, making it a reliable and efficient choice for various amplifier applications.

Maximum Drain Current (Abs) (ID): 7 A

With a maximum drain current of 7 A, this RF power FET delivers high-power amplification capability, allowing for robust signal processing in demanding RF amplifier designs.

No. of Terminals: 2

Having two terminals simplifies the installation process and ensures secure connections, making this RF power FET a versatile option for amplifier circuits.

Maximum Power Dissipation (Abs): 79 W

With a maximum power dissipation of 79 W, this RF power FET can handle high-power levels, ensuring stable operation and reliable performance in power-hungry amplifier applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style provides compactness and efficient utilization of space, making this RF power FET suitable for miniaturized electronic systems where size is a critical factor.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Built using metal-oxide semiconductor technology, this RF power FET ensures efficient signal processing, low power consumption, and enhanced reliability, making it a reliable choice for amplifier applications.

Maximum Operating Temperature: 165 °C

With a maximum operating temperature of 165°C, this RF power FET excels in high-temperature environments, ensuring stable performance and long-term reliability even under demanding operating conditions.

Transistor Element Material: SILICON

The use of silicon as the transistor element material enables high-performance signal amplification, making this RF power FET a reliable choice for various amplifier applications.

Terminal Finish: TIN LEAD

The tin-lead terminal finish enhances the durability and conductivity of the RF power FET, ensuring long-term reliability and efficient signal transmission.

Terminal Position: DUAL

Featuring dual terminal positions, this RF power FET offers flexibility in circuit connectivity and facilitates easy integration, making it a versatile option for amplifier designs.

Case Connection: SOURCE

The case connection to the source terminal provides improved heat dissipation and efficient thermal management, ensuring reliable and consistent performance of the RF power FET in high-power amplifier applications.

Technical Specifications

RF Power Field Effect Transistors (FET) PD55025S attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD55025S Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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