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SD2943

STMicroelectronics

SD2943 by STMicroelectronics

SD2943 by STMicroelectronics is an N-CHANNEL RF Power FET with a 130V DS Breakdown Voltage. It operates in the ULTRA HIGH FREQUENCY BAND, with a max ID of 40A and 648W power dissipation. Ideal for AMPLIFIER applications due to its ENHANCEMENT MODE operation and SOURCE case connection.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,178 parts In-Stock

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2,178

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Vyrian

USA . 1,277 parts In-Stock

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1,277

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Nova Conductors

Japan . 1,000 parts In-Stock

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1,000

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Digiode

USA . 292 parts In-Stock

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Corohmni

South Africa . 840 parts In-Stock

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$0.304

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840

$0.304

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IDEA Electronic Components Group

UK . 1,524 parts In-Stock

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$0.581

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$0.523

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1,524

$0.581

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$0.523

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MKK Technologies

India . 713 parts In-Stock

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$1.093

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713

$1.093

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DigiPath Technology Company

USA . 713 parts In-Stock

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$1.093

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713

$1.093

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Ampacity Inc.

Singapore . 811 parts In-Stock

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$47.050

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811

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Argo Parts USA

USA . 5,273 parts In-Stock

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Corphita

USA . 3,348 parts In-Stock

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Parana Technologies

USA . 1,846 parts In-Stock

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$0.695

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$0.695

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Continental Prestige Electronics

USA . 1,005 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Authorized Procurement Solutions

USA . 4 parts In-Stock

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Overview

Upgrade your RF power amplifier designs with the SD2943 by STMicroelectronics. Known for their top-quality semiconductor components, STMicroelectronics delivers reliable and efficient solutions for a wide range of applications. The N-CHANNEL single configuration of this FET transistor allows for enhanced performance in amplifier applications within the ultra-high frequency band. With a high DS breakdown voltage and maximum power dissipation, the SD2943 offers unparalleled value and benefits for customers seeking superior RF power amplification. Trust STMicroelectronics for cutting-edge technology and exceptional product quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the transistor, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower ON-resistance and higher electron mobility, leading to better overall performance in amplification applications.

Configuration: SINGLE

The single configuration simplifies the circuit design and makes it easier to integrate this transistor into amplifier circuits.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this transistor is optimized for high-frequency signal amplification.

Surface Mount: YES

The surface-mount capability of this transistor allows for easy and efficient PCB assembly, saving time and resources during manufacturing.

Minimum DS Breakdown Voltage: 130 V

The high breakdown voltage ensures reliability and protection against voltage spikes and fluctuations in the circuit.

Package Shape: ROUND

The round package shape facilitates easier installation and placement in the circuit, optimizing space usage.

Terminal Form: FLAT

The flat terminal form enables secure connections and reduces the risk of disconnection or short-circuiting.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control over the amplification process, resulting in higher efficiency and performance.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Ideal for applications requiring ultra-high-frequency signal processing, making it suitable for advanced communication systems.

Maximum Drain Current (Abs) (ID): 40 A

The high maximum drain current capability allows for handling high-power signals with ease, making it suitable for demanding amplifier applications.

No. of Terminals: 4

Having four terminals provides flexibility in circuit connections and allows for versatile usage in different amplifier configurations.

Maximum Power Dissipation (Abs): 648 W

The high maximum power dissipation rating ensures the transistor can handle high-power signals without overheating, ensuring long-term reliability.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure mounting and easy integration in amplifier systems, ensuring stability and reliability in operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high reliability and performance in high-frequency applications, making it an ideal choice for amplifier circuits.

Maximum Operating Temperature: 200 °C

The high maximum operating temperature tolerance allows the transistor to operate in harsh environments without degrading performance, ensuring long-term reliability.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability in amplifier applications, making it a preferred choice for high-frequency signal processing.

Terminal Position: RADIAL

The radial terminal position allows for easy circuit connection and secure mounting, ensuring stable operation in amplifier applications.

Case Connection: SOURCE

The source case connection provides a common reference point for the transistor, simplifying circuit design and integration into amplifier systems.

Technical Specifications

RF Power Field Effect Transistors (FET) SD2943 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

130 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

O-PRFM-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

RADIAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

SD2943 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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