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PD55008STR-E

STMicroelectronics

PD55008STR-E by STMicroelectronics

PD55008STR-E by STMicroelectronics is an N-CHANNEL RF Power Field Effect Transistor (FET) with a min DS breakdown voltage of 40V. It is used as an amplifier in the ultra high frequency band, with a max drain current of 4A and a max power dissipation of 52.8W.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,129 parts In-Stock

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8,129

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Digiode

USA . 4,768 parts In-Stock

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4,768

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Anansix

USA . 1,233 parts In-Stock

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1,233

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Nova Conductors

Japan . 76 parts In-Stock

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76

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 8 parts In-Stock

1+ parts

$0.720

100+ parts

-

1k+ parts

$0.648

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8

$0.720

-

$0.648

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MKK Technologies

India . 212 parts In-Stock

1+ parts

$1.355

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-

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212

$1.355

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DigiPath Technology Company

USA . 212 parts In-Stock

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$1.355

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212

$1.355

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AZTECH Wire

Italy . 624 parts In-Stock

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$16.501

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624

$16.501

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Ampacity Inc.

Singapore . 1,242 parts In-Stock

1+ parts

$25.050

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1,242

$25.050

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Semicontronic

India . 205 parts In-Stock

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$34.050

100+ parts

$33.199

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$33.028

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205

$34.050

$33.199

$33.028

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Corphita

USA . 3,458 parts In-Stock

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3,458

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,318 parts In-Stock

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$0.861

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1,318

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$0.861

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Argo Parts USA

USA . 1,253 parts In-Stock

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1,253

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Continental Prestige Electronics

USA . 1,150 parts In-Stock

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Overview

Experience the unmatched quality and reliability of the PD55008STR-E by STMicroelectronics, a leading manufacturer in the industry. This RF Power Field Effect Transistor (FET) offers incredible value with its single configuration and N-CHANNEL polarity. Ideal for amplifier applications, this product delivers exceptional performance in the ultra-high frequency band. With a maximum drain current of 4A and a maximum power dissipation of 52.8W, it ensures optimal functionality and efficiency. Its small outline package style and matte tin terminal finish further enhance its appeal. Trust STMicroelectronics to provide you with cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. This material provides durability and protection to the RF Power FET, making it suitable for various operating conditions.

Polarity or Channel Type:

N-CHANNEL. This channel type allows for enhanced amplification capabilities, delivering high performance and efficiency.

Configuration:

SINGLE. The single configuration simplifies the circuit design and reduces complexity, resulting in better reliability and ease of use.

Transistor Application:

AMPLIFIER. With its amplifying capabilities, this RF Power FET can enhance the signal strength efficiently, making it ideal for use in amplification applications.

Surface Mount:

YES. The surface-mount capability makes the installation process convenient and allows for compact PCB design, saving valuable space in electronic systems.

Minimum DS Breakdown Voltage:

40 V. This high breakdown voltage ensures reliable operation and protection against potential voltage surges, making it suitable for demanding applications.

Package Shape:

RECTANGULAR. The rectangular shape offers efficient utilization of space and seamless integration into various electronic devices.

Terminal Form:

FLAT. The flat terminal form facilitates easy soldering and ensures secure connections, reducing the risk of electrical failures.

Operating Mode:

ENHANCEMENT MODE. The enhancement mode operation allows for higher efficiency and better control over the power amplification process, resulting in improved overall performance.

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND. This RF Power FET is designed to operate in the ultra-high-frequency range, enabling it to handle high-frequency signals with precision and accuracy.

No. of Elements:

1. With a single element, this RF Power FET provides simplicity and ease of use in circuit design and handling.

Maximum Drain Current (Abs) (ID):

4 A. The ability to handle a high drain current of 4 A ensures optimal power output and performance, making this FET suitable for power-intensive applications.

No. of Terminals:

2. Having only two terminals simplifies the connection process and minimizes complexity, ensuring straightforward integration into various circuits.

Maximum Power Dissipation (Abs):

52.8 W. This high power dissipation capability allows for efficient heat dissipation, ensuring stable operation even under demanding conditions.

Package Style (Meter):

SMALL OUTLINE. The small outline package style provides versatility and compatibility with different electronic systems, making it easy to integrate the RF Power FET.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR. This advanced technology offers high efficiency, low power consumption, and excellent performance characteristics, making it a reliable choice for various applications.

Maximum Operating Temperature:

165 °C. With a maximum operating temperature of 165°C, this RF Power FET can withstand high-temperature environments, ensuring stable performance in demanding conditions.

Transistor Element Material:

SILICON. The silicon-based transistor element material provides excellent electrical properties, enabling high-performance amplification and reliability.

Terminal Finish:

MATTE TIN. The matte tin terminal finish ensures good conductivity and corrosion resistance, enhancing the overall reliability and longevity of the RF Power FET.

Terminal Position:

DUAL. The dual terminal position provides versatility in circuit design and facilitates easy connection and integration into various systems.

Moisture Sensitivity Level (MSL):

1. With an MSL of 1, this RF Power FET can withstand extended exposure to moisture without compromising its performance or reliability.

Case Connection:

SOURCE. The case connection to the source enhances thermal dissipation capabilities, ensuring efficient heat management and reliable operation even under high-power conditions.

Technical Specifications

RF Power Field Effect Transistors (FET) PD55008STR-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD55008STR-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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