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SD2942

STMicroelectronics

SD2942 by STMicroelectronics

SD2942 by STMicroelectronics is an N-channel RF power FET designed for ultra-high frequency applications. It features a max drain current of 40 A, breakdown voltage of 130 V, and can dissipate up to 500 W. Ideal for high-performance RF amplification in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,072 parts In-Stock

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3,072

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Anansix

USA . 1,723 parts In-Stock

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1,723

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Digiode

USA . 795 parts In-Stock

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795

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Electronics Depot

USA . 1 parts In-Stock

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1

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IDEA Electronic Components Group

UK . 2,005 parts In-Stock

1+ parts

$0.854

100+ parts

-

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$0.768

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2,005

$0.854

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$0.768

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MKK Technologies

India . 359 parts In-Stock

1+ parts

$1.605

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359

$1.605

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DigiPath Technology Company

USA . 359 parts In-Stock

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$1.605

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359

$1.605

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AZTECH Wire

Italy . 317 parts In-Stock

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$14.310

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317

$14.310

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Component Stockers USA

USA . 3,368 parts In-Stock

1+ parts

$104.790

100+ parts

$99.550

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$96.400

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3,368

$104.790

$99.550

$96.400

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Parana Technologies

USA . 2,032 parts In-Stock

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$1.021

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2,032

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$1.021

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 1,620 parts In-Stock

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Overview

Unlock unparalleled performance with the SD2942 by STMicroelectronics, a standout N-Channel RF Power FET designed for ultra-high frequency applications. Engineered for excellence, this robust device combines reliability and efficiency, making it ideal for demanding industries like telecommunications and broadcasting. With ST’s commitment to quality and innovation, you gain superior power handling and thermal management that elevate your projects to new heights. Experience the difference in performance and peace of mind!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy packaging ensures good durability and protection against environmental factors, making this FET suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and better performance characteristics, making them ideal for high efficiency applications.

Configuration: SINGLE

A single configuration allows for straightforward integration into circuits, providing ease of use and simplicity in design.

Surface Mount: YES

Surface mount technology offers reduced size and weight, enabling more compact design in modern electronic devices.

Minimum DS Breakdown Voltage: 130 V

A breakdown voltage of 130 V ensures reliable operation in high-voltage environments, adding to the robustness of the device.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space and can facilitate heat dissipation, enhancing overall performance.

Terminal Form: FLAT

Flat terminals provide better connection stability and ease of soldering, contributing to a reliable circuit integration.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides better control over the flow of current, allowing for higher efficiency and better signal processing.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operating in the ultra-high frequency band makes this FET suitable for advanced communication systems and other high-speed applications.

Maximum Drain Current (Abs) (ID): 40 A

A maximum drain current of 40 A enables the FET to handle substantial power loads, ideal for demanding applications.

No. of Terminals: 4

Four terminals allow for versatile connections and functionality within a variety of circuit layouts, improving design flexibility.

Maximum Power Dissipation (Abs): 500 W

With the ability to dissipate 500 W, this FET can effectively manage heat in high-power applications, ensuring long-term reliability.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging offers excellent mechanical stability and thermal performance, making it suitable for high-demand environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology results in high-speed performance and low power consumption, which are critical factors for modern electronic systems.

Maximum Operating Temperature: 200 °C

A high operating temperature of 200 °C ensures that the FET can withstand harsh conditions, enhancing its application range.

Transistor Element Material: SILICON

Silicon is a reliable and widely used semiconductor material, providing consistent performance and availability in the market.

Maximum Drain Current (ID): 40 A

Reiterating the maximum drain current of 40 A emphasizes its robustness, suitable for high-demand applications.

Terminal Position: DUAL

Dual terminal positioning can facilitate better layout designs, optimizing space and enhancing electrical connections.

Case Connection: SOURCE

A source connection configuration simplifies the circuit design, facilitating easier integration and reduced complexity in layout.

Technical Specifications

RF Power Field Effect Transistors (FET) SD2942 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

130 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDFM-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

SD2942 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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