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BLF177,112

NXP Semiconductors

BLF177,112 by NXP Semiconductors

BLF177,112 by NXP Semiconductors is an N-CHANNEL RF Power FET with 125V DS Breakdown Voltage and 16A Drain Current. Ideal for amplifier applications in the VHF band, it features a max power dissipation of 220W and operates in enhancement mode.

Median Price

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Lifecycle Status

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RFMW

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Digiode

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Nova Conductors

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Aztec Data Supply Inc.

USA . 2,925 parts In-Stock

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AZTECH Wire

Italy . 487 parts In-Stock

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Ampacity Inc.

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Component Stockers USA

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Corphita

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Continental Prestige Electronics

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Overview

Elevate your RF power amplifier designs with the BLF177,112 from NXP Semiconductors. This high-quality N-CHANNEL FET offers unparalleled performance in the VERY HIGH FREQUENCY BAND, making it ideal for applications requiring maximum power dissipation and reliability. With a single configuration and flat terminal form, this transistor is designed for ease of use and efficiency. Trust NXP Semiconductors for cutting-edge technology and superior products that deliver exceptional value and benefits to customers looking to amplify their projects to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This high-quality material ensures durability and reliability, making the product suitable for various applications and environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher mobility and faster switching speeds, making them ideal for high-frequency applications.

Configuration: SINGLE

The single configuration simplifies the design and implementation of the transistor circuit.

Transistor Application: AMPLIFIER

Specifically designed for amplification purposes, ensuring optimal performance in amplifier circuits.

Surface Mount: YES

Surface mount technology allows for easy and compact integration into PCBs, saving space and facilitating mass production.

Maximum Power Dissipation: 220 W

With a high power dissipation rating, this FET can handle high power loads without overheating, ensuring reliability in demanding applications.

Maximum Operating Temperature: 200 °C

The high operating temperature range allows for use in a wide range of environments and applications.

Technical Specifications

RF Power Field Effect Transistors (FET) BLF177,112 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

ISOLATED

Configuration:

Minimum DS Breakdown Voltage:

125 V

Maximum Drain Current (Abs) (ID):

16 A

Maximum Drain Current (ID):

16 A

Maximum Drain-Source On Resistance:

.3 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

O-CRFM-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

220 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

RADIAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BLF177,112 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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