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PD57060S-E

STMicroelectronics

PD57060S-E by STMicroelectronics

PD57060S-E by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 7 A, a breakdown voltage of 65 V, and operates in the ultra-high frequency band. This compact surface-mount device ensures efficient performance in demanding environments.

Median Price

$62.720

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 561 parts In-Stock

1+ parts

$59.730

100+ parts

$48.070

1k+ parts

-

10k+ parts

-

561

$59.730

$48.070

-

-

DigiKey

USA . 356 parts In-Stock

1+ parts

$62.720

100+ parts

$46.126

1k+ parts

-

10k+ parts

-

356

$62.720

$46.126

-

-

Element14

Singapore . 561 parts In-Stock

1+ parts

$71.790

100+ parts

$66.010

1k+ parts

-

10k+ parts

-

561

$71.790

$66.010

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 952 parts In-Stock

1+ parts

$33.240

100+ parts

-

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-

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952

$33.240

-

-

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Vyrian

USA . 5,494 parts In-Stock

1+ parts

-

100+ parts

-

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5,494

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Anansix

USA . 1,972 parts In-Stock

1+ parts

-

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1,972

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 184 parts In-Stock

1+ parts

$1.123

100+ parts

-

1k+ parts

$1.011

10k+ parts

-

184

$1.123

-

$1.011

-

MKK Technologies

India . 1,834 parts In-Stock

1+ parts

$2.112

100+ parts

-

1k+ parts

-

10k+ parts

-

1,834

$2.112

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-

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DigiPath Technology Company

USA . 1,834 parts In-Stock

1+ parts

$2.112

100+ parts

-

1k+ parts

-

10k+ parts

-

1,834

$2.112

-

-

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Ampacity Inc.

Singapore . 68 parts In-Stock

1+ parts

$29.740

100+ parts

-

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-

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68

$29.740

-

-

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Corphita

USA . 3,652 parts In-Stock

1+ parts

$31.491

100+ parts

-

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3,652

$31.491

-

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Continental Prestige Electronics

USA . 349 parts In-Stock

1+ parts

$44.990

100+ parts

-

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349

$44.990

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Component Stockers USA

USA . 545 parts In-Stock

1+ parts

$53.620

100+ parts

$45.170

1k+ parts

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10k+ parts

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545

$53.620

$45.170

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QUARKTWIN TECHNOLOGY LTD

USA . 27,932 parts In-Stock

1+ parts

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27,932

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Microchip USA

USA . 3,141 parts In-Stock

1+ parts

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3,141

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 1,344 parts In-Stock

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1,344

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Parana Technologies

USA . 543 parts In-Stock

1+ parts

-

100+ parts

$1.343

1k+ parts

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10k+ parts

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543

-

$1.343

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Eastek

USA . 173 parts In-Stock

1+ parts

-

100+ parts

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173

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Overview

Elevate your designs with the PD57060S-E from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel RF Power FET, perfect for amplifying ultra-high frequency signals, delivers unmatched performance and reliability in compact applications. With robust thermal management and surface mount convenience, it ensures efficiency while minimizing space. Choose STMicroelectronics for superior quality and innovation that empowers your projects to shine!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental stress, making this product suitable for diverse applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically provide higher efficiency and speed, making them ideal for amplifier applications.

Configuration: SINGLE

A single configuration allows for compact design, reducing space requirements in circuits.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET enhances signal strength, making it ideal for audio and RF applications.

Surface Mount: YES

Surface mount technology enables easier automation in manufacturing and saves board space, facilitating compact designs.

Minimum DS Breakdown Voltage: 65 V

A high breakdown voltage ensures reliability and allows the transistor to handle significant voltage variations.

Package Shape: RECTANGULAR

The rectangular shape contributes to efficient use of PCB real estate and can simplify layout designs.

Terminal Form: FLAT

Flat terminals ensure good surface contact for reliable soldering and performance in circuit applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides excellent control of the transistor, allowing for lower power consumption during idle states.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operating in the ultra high frequency band, this FET is perfect for high-speed applications, including RF communication.

Maximum Drain Current (Abs) (ID): 7 A

A maximum drain current of 7 A allows this FET to handle significant load currents, ideal for robust applications.

No. of Terminals: 2

With only two terminals, it simplifies circuit integration while being cost-effective and space-efficient.

Maximum Power Dissipation (Abs): 0.079 W

Low power dissipation supports efficient operation, reducing heat generation and prolonging device lifespan.

Package Style (Meter): SMALL OUTLINE

A small outline package is advantageous for compact designs, allowing manufacturers to build smaller devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high input impedance and fast switching speeds, expanding application versatility.

Maximum Operating Temperature: 165 °C

A high maximum operating temperature enhances performance in extreme conditions, ensuring reliability in critical applications.

Transistor Element Material: SILICON

Silicon as the material contributes to excellent performance characteristics and reliability in various applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent solderability and protects terminals from oxidation, improving connectivity.

Terminal Position: DUAL

Dual terminal position facilitates better layout versatility for PCB design, ensuring efficient routing.

Moisture Sensitivity Level (MSL): 3

An MSL level of 3 indicates manageable moisture sensitivity, making handling during assembly easier with proper precautions.

Case Connection: SOURCE

Source connection provides a straightforward implementation in amplification circuits, improving ease of use.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow temperature tolerance of 30 seconds allows for flexible manufacturing processes without damaging the device.

Peak Reflow Temperature °C: 250

A high peak reflow temperature ensures compatibility with modern soldering techniques, enhancing manufacturing efficiency.

Technical Specifications

RF Power Field Effect Transistors (FET) PD57060S-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD57060S-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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